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Contact Name  | Contact Details | Job Title | Company Name |
|---|---|---|---|
JA Joe Alig |  Phone Email | Founder & Chief Executive Officer & Chief Operating Officer & Chief Financial Officer & Chief Technology Officer & Senior Hardware Engineer & Machinist & Lead Assembler & Purchasing Agent & Document Control Clerk & Janitor |  A-5 Engineering |
RR Rick Rosler | PhoneEmail | Ohio Assembly & Engine Site Controller (Cleveland) |  Ford |
JB Jean-Jacques Billant | PhoneEmail | Vice President, Assembly Line & Manufacturing Eng |  Dassault Aviation |
AG Antoine Goncalves | PhoneEmail | Vice President, Assembly Line & Manufacturing Engineering |  Dassault Falcon Jet |
RS Ravinder Sharma | PhoneEmail | Regional Assembly Engineering Head (India) |  Gestamp Automoción |
RD Ryan Dronson | PhoneEmail | Associate Director, Device Assembly Engineering |  Lilly |
MM Milos Milosevic | PhoneEmail | Head Assembly Engineer |  Via Ocel |
SG St. Guruh Adhi Surya WP | PhoneEmail | Section of Assembly Engineering At Mmki Head |  Mitsubishi Motors |
MK Matthew Kurtz | PhoneEmail | Director, Assembly Engineering |  Rochester Electronics |
AK Aaron Krueger | PhoneEmail | Director, Assembly Engineering Region (US) | Gestamp Automoción |
CK Caleb Kerr | PhoneEmail | Director, Engineering Idap Expansion Assembly & Logistics | Lilly |
WH William Hanmann | PhoneEmail | Director, Assembly, Engine Distribution & Support Operations |  Mercury Marine |
CR Chris Rumer | PhoneEmail | Director, Assembly Engineering |  Intel |
UV Umeet Vohra | PhoneEmail | Global Director, Methods Final Assembly & 7500 Wing ( Industrial Engineering ) |  Bombardier |
CL Chow Lai | PhoneEmail | Assembly Engineering Operations Head |  NXP |
LV Leslie Varga | PhoneEmail | Global Product Assembly Division At Nordson Corporation Director, Engineering |  Nordson |
NM Ng Mei Fong | PhoneEmail | Director, Assembly Engineering | Intel |
MN Maniraj Nambi | PhoneEmail | Assembly Operations & Manufacturing Engineering Head |  Anora |
ZD Zoran Djurich | PhoneEmail | Global Director, General Assembly Manufacturing Engineering Center |  General Motors |
SD Son Dw | PhoneEmail | Director, Assembly Process Engineering (Flip Chip & Wire Bond Technology) |  STATS ChipPAC Ltd. |