STATS ChipPAC Ltd.
Highly Engaged Employees
Highly Engaged EmployeesElectronics · Singapore · 5K - 10K Employees
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Overview
Headquarters
Techpoint 10 Ang Mo Kio St. 65 05-17/20,...Website
www.statschippac.comRevenue
$2 BillionIndustry
ZI Rank: 1
Signal Type
Dec
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ZI Rank
2
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1
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About STATS ChipPAC Ltd.
STATS ChipPAC Pte. Ltd. is a leading service provider of semiconductor packaging design and characterization, wafer bump, assembly and test solutions for diverse end market applications in communications, digital consumer, computing and automotive electronics. Headquartered in Singapore, STATS ChipPAC has design, research and development, manufacturing and customer support offices throughout Asia, the United States and Europe. STATS ChipPAC is a member of the JCET Group of companies.Explore more
STATS ChipPAC Ltd. Org Chart
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Company Profile Activity
Activity Insights
STATS ChipPAC Ltd. is experiencing very low activity levels compared to other companies in the Manufacturing sector.
What does this means?
STATS ChipPAC Ltd. is drawing exceptional interest within the Manufacturing industry, suggesting notable developments or strong market momentum, learn more about STATS ChipPAC Ltd..
STATS ChipPAC Ltd. Tech Stack
A closer look at the technologies used by STATS ChipPAC Ltd.
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Most Recent Scoops
Event
Product Marketing, Events, Sales, Logistics / Supply Chain, Machinery, Field /Outside Sales, Field Marketing, Manufacturing Operations, Operations
Event
Product Marketing, Events, Sales, Logistics / Supply Chain, Machinery, Field /Outside Sales, Energy / Power, Field Marketing, Manufacturing Operations, Operations
Event
Product Marketing, Events, Sales, Logistics / Supply Chain, Machinery, Field /Outside Sales, Energy / Power, Field Marketing, Manufacturing Operations, Operations
Hiring Plans
STATS ChipPAC Ltd. has more open roles in Sales than it has had at any time in the past 12 months.
Hiring Plans
Earnings
Earnings
STATS ChipPAC Ltd. News & Media
STATS ChipPAC CTO: Scaling innovation defines AI and HPC's next era
IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge is no longer invention itself, but turning invention into a manufacturable, scalable reality.Chinese OSATs gear up for advanced packaging
Chinese OSATs including Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics (TFME) have stepped up their deployments for advanced packaging, offering services to capitalize on the AI chip boom, according to industry sources.STATS ChipPAC's Automotive Millimeter Wave Radar Packaging Solution Receives Customer Award
SHANGHAI, Feb. 24, 2023 /PRNewswire/ -- STATS ChipPAC PTE. LTD. won the "Excellent Supplier Award of 2022" issued by Calterah. This award was in recognition of STATS ChipPAC for its excellent service in cooperation with Calterah in the development of automotive millimeter wave radar...
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STATS ChipPAC Pte. Ltd. is a leading service provider of semiconductor packaging design and characterization, wafer bump, assembly and test solutions for diverse end market applications in communications, digital consumer, computing and automotive electronics. Headquartered in Singapore, STATS ChipPAC has design, research and development, manufactu... Read More
