Leadership Overview
STATS ChipPAC Ltd. has 4 executives leading key functions including technology innovation, group-wide technical strategy, global information systems, and regional management.
Focused on delivering advanced semiconductor packaging solutions, STATS ChipPAC Ltd. drives excellence in wafer bump, assembly, and test services to support the evolving needs of the global communications, computing, and automotive electronics markets.
Focused on delivering advanced semiconductor packaging solutions, STATS ChipPAC Ltd. drives excellence in wafer bump, assembly, and test services to support the evolving needs of the global communications, computing, and automotive electronics markets.
Leadership Roles at STATS ChipPAC Ltd.
Sumrian Suthivong - President and MD
Sumrian Suthivong, the President and MD at STATS ChipPAC Ltd., executes the corporate vision and manages the overall business performance of the organization. Overseeing regional manufacturing and customer support offices, the President and MD ensures alignment with the strategic goals of the JCET Group. This leadership role involves driving growth in the communications, computing, and automotive electronics sectors by optimizing resource allocation and market expansion. By fostering strong relationships with key stakeholders, Sumrian Suthivong maintains the company's position as a leading service provider in the semiconductor industry. The President and MD also monitors financial health and operational excellence across all international sites to ensure consistent profitability. Through decisive management of regional assets, Suthivong directs the company toward sustainable development and long-term success. Ultimately, the President and MD secures the operational stability required to deliver high-quality packaging and test solutions to a global client base.
Il Kwon Shim - Chief Technology Officer
Il Kwon Shim, the Chief Technology Officer at STATS ChipPAC Ltd., directs the development of advanced semiconductor packaging design and characterization processes. Overseeing research and development initiatives, the Chief Technology Officer ensures the company maintains a competitive edge in wafer bump and assembly solutions. This leadership role involves close collaboration with engineering teams to refine technical roadmaps for diverse end market applications in communications and digital consumer electronics. By optimizing manufacturing methodologies, Il Kwon Shim directly impacts the efficiency and quality of semiconductor output across global facilities. The Chief Technology Officer also manages the integration of new materials and processes to meet the rigorous demands of automotive electronics. Through constant innovation, Shim secures the technical leadership of the organization within the broader JCET Group ecosystem, ensuring that all technological advancements align with the long-term strategic objectives of the company.
Choon Lee - Group Chief Technology Officer
Choon Lee, the Group Chief Technology Officer at STATS ChipPAC Ltd., architects the overarching technical strategy across the entire JCET Group network. Managing high-level research and development, the Group Chief Technology Officer aligns regional technical capabilities in Asia, the United States, and Europe to ensure unified service delivery. This leadership role involves evaluating emerging semiconductor trends to guide long-term investment in assembly and test infrastructure. By synchronizing technical standards, Choon Lee facilitates seamless collaboration between global design centers and manufacturing hubs. The Group Chief Technology Officer also monitors the performance of advanced packaging platforms to support computing and automotive market growth. Through strategic oversight of technical assets, Lee drives the standardization of processes that enhance operational reliability. Ultimately, the Group Chief Technology Officer ensures that the company remains at the forefront of semiconductor packaging innovation while maintaining consistent quality benchmarks across all international operations.
Danny Ong - Vice President & Chief Information Officer (Global Information System)
Danny Ong, the Vice President & Chief Information Officer (Global Information System) at STATS ChipPAC Ltd., directs the digital infrastructure and information systems supporting global manufacturing operations. Overseeing the deployment of enterprise-wide software and data security protocols, the Vice President & Chief Information Officer (Global Information System) ensures seamless connectivity between design, research, and customer support offices. This leadership role involves optimizing IT frameworks to improve data-driven decision-making across the semiconductor assembly and test lifecycle. By implementing robust cybersecurity measures, Danny Ong protects critical intellectual property and maintains the integrity of global supply chain communications. The Vice President & Chief Information Officer (Global Information System) also manages the integration of digital tools that enhance operational efficiency in Singapore and beyond. Through the modernization of information systems, Ong supports the company's ability to scale production capabilities while maintaining high standards of service for diverse end market applications.
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Frequently Asked Questions Regarding STATS ChipPAC Ltd. Top Executives and Leadership Team
