Leadership Overview
STATS ChipPAC Ltd. has 7 executives leading key functions including semiconductor packaging design, wafer bump assembly, test solutions, and global information systems.
Operating as a member of the JCET Group, STATS ChipPAC Ltd. delivers advanced semiconductor packaging and characterization services to drive innovation across communications, computing, and automotive electronics markets worldwide.
Operating as a member of the JCET Group, STATS ChipPAC Ltd. delivers advanced semiconductor packaging and characterization services to drive innovation across communications, computing, and automotive electronics markets worldwide.
Leadership Roles at STATS ChipPAC Ltd.
Sumrian Suthivong - President and MD
Sumrian Suthivong, the President and MD at STATS ChipPAC Ltd., directs the total business strategy and operational performance of the organization. Suthivong architects the growth initiatives that expand the market reach of the company in the communications, computing, and automotive electronics sectors. By overseeing the executive team, the President and MD ensures that all departments remain aligned with the mission of providing superior semiconductor packaging and test solutions. Sumrian Suthivong manages the relationships with key stakeholders and the JCET Group to ensure consistent financial performance and strategic cohesion. This leadership role involves navigating the complexities of the global semiconductor market, from manufacturing in Asia to customer support in the United States and Europe. Through the implementation of high-level operational policies, the President and MD drives efficiency and profitability across all business units. Suthivong fosters a culture of excellence, ensuring that the company continues to deliver high-value services that meet the rigorous demands of modern electronics applications.
Il Kwon Shim - Chief Technology Officer
Il Kwon Shim, the Chief Technology Officer at STATS ChipPAC Ltd., directs the long-term research and development roadmap for semiconductor packaging technologies. Shim architects the technical strategy that enables the company to provide cutting-edge wafer bump and assembly solutions. By overseeing the innovation pipeline, the Chief Technology Officer ensures that the organization remains at the forefront of the communications and computing industries. Il Kwon Shim collaborates with the Board to align technological investments with emerging market trends in miniaturization and high-speed data processing. This role involves managing the intellectual property portfolio and fostering partnerships with academic and industry research institutions. Through the guidance of engineering teams, the Chief Technology Officer drives the development of next-generation packaging architectures that support higher performance and lower power consumption. Shim maintains a focus on operational excellence, ensuring that new technologies transition smoothly from the laboratory to large-scale manufacturing environments across the global footprint of the company.
Danny Ong - Vice President & Chief Information Officer (Global Information System)
Danny Ong, the Vice President & Chief Information Officer (Global Information System) at STATS ChipPAC Ltd., manages the digital infrastructure that supports global manufacturing and customer support operations. Ong architects secure, scalable information systems that facilitate real-time data exchange between design centers and production facilities. By overseeing the enterprise resource planning platforms, the Vice President & Chief Information Officer (Global Information System) ensures seamless coordination across the international offices in Asia, the United States, and Europe. Danny Ong drives the digital transformation strategy, implementing advanced analytics to improve operational visibility and decision-making speed. This leadership role involves protecting the intellectual property of the company through robust cybersecurity frameworks. By optimizing the IT architecture, the Vice President & Chief Information Officer (Global Information System) supports the agility of the organization in responding to market fluctuations. Ong ensures that all information systems remain resilient, providing the backbone for the complex semiconductor packaging services provided to diverse end-market applications.
Choon Lee - Group Chief Technology Officer
Choon Lee, the Group Chief Technology Officer at STATS ChipPAC Ltd., defines the overarching technical vision for the entire JCET Group of companies. Lee architects the synergy between different business units to maximize the impact of semiconductor packaging design and characterization services. By overseeing the group-wide technology strategy, the Group Chief Technology Officer ensures that the organization maintains a unified approach to innovation in the communications and automotive sectors. Choon Lee coordinates with regional technical leads to standardize manufacturing processes and quality benchmarks across all global sites. This role involves identifying strategic technology acquisitions and partnerships that expand the capabilities of the company. Through the leadership of cross-functional technical committees, the Group Chief Technology Officer drives the adoption of advanced assembly techniques that improve product performance. Lee ensures that the technical roadmap remains aligned with the evolving needs of the global electronics market, securing the position of the company as a premier service provider in the semiconductor industry.
Jin Dongmei - Deputy Director
Jin Dongmei, the Deputy Director at STATS ChipPAC Ltd., manages internal operational workflows focused on semiconductor assembly efficiency. Dongmei directs cross-functional teams to optimize manufacturing throughput for digital consumer electronics. By refining production protocols, the Deputy Director ensures high-yield outcomes across Asian manufacturing facilities. This leadership role involves constant collaboration with engineering departments to integrate advanced wafer bump technologies into existing assembly lines. Jin Dongmei maintains rigorous quality standards, ensuring all output meets the precise requirements of global communications clients. Through the implementation of lean manufacturing principles, the Deputy Director reduces operational waste and enhances overall factory productivity. The strategic focus remains on scaling capacity to meet the surging demand for high-performance computing components. By aligning production schedules with market requirements, Dongmei secures consistent delivery timelines for international partners, thereby strengthening the competitive position of the organization within the complex semiconductor landscape.
JooSang Kim - Deputy Director
JooSang Kim, the Deputy Director at STATS ChipPAC Ltd., oversees the strategic deployment of semiconductor test solutions for automotive electronics. Kim architects testing frameworks that validate the reliability of chips under extreme environmental conditions. By supervising the integration of automated test equipment, the Deputy Director ensures that all products adhere to stringent industry safety standards. JooSang Kim coordinates with research and development units to anticipate future testing requirements for next-generation automotive sensors. This role demands deep technical oversight of the characterization processes that define the performance of complex integrated circuits. Through the management of regional testing centers, the Deputy Director facilitates seamless quality assurance for clients across the United States and Europe. Kim drives continuous improvement initiatives to shorten test cycle times, directly impacting the speed-to-market for automotive customers. By maintaining high operational standards, the Deputy Director supports the long-term growth of the company in the high-stakes automotive sector.
Jao Huang - Deputy Director
Jao Huang, the Deputy Director at STATS ChipPAC Ltd., leads the design and characterization services for advanced semiconductor packaging. Huang manages the technical teams responsible for translating complex customer requirements into functional packaging solutions. By overseeing the design phase, the Deputy Director ensures that thermal and electrical performance metrics align with the needs of modern computing applications. Jao Huang coordinates with manufacturing leads to ensure that design specifications translate perfectly into high-volume production. This leadership position involves evaluating new materials and packaging architectures to maintain a technological edge in the competitive semiconductor market. Through the supervision of design centers, the Deputy Director facilitates rapid prototyping and iterative development cycles for global clients. Huang drives innovation by fostering a culture of technical excellence and precision. By optimizing the design-to-assembly pipeline, the Deputy Director enhances the overall value proposition of the company, ensuring that every package meets the highest standards of performance and reliability.
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Frequently Asked Questions Regarding STATS ChipPAC Ltd. Top Executives and Leadership Team
