Contacts
Likely to Engage Contact 
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Company Name/URL/Ticker
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Location
Contact Name | Contact Details | Job Title | Company Name |
|---|---|---|---|
SF Sanduni Fernando | Module Development Engineer | Intel | |
QL Qiyuan Lin | Packaging Module Development Engineer | Intel | |
RI Rohit Iyer | Ltd Module Development Engineer | Intel | |
RP Reece Painter | Module Development Engineer | Intel | |
JT Jean-Philippe Turmaud | Technology Development Module & Integration Yield Engineer | Intel | |
TI Timothy Ismael | Module Development Engineer | Intel | |
PR Pravakar Rajbhandari | Thin Film Module Development Engineer | Intel | |
BH Brandon Hurt | Reticle Module Development Engineer | Intel | |
MA Md Ahad Talukder | Module, Metrology Advanced Packaging Technology Development Engineer (Hybrid Bonding) | Intel | |
ZO Zakai Olsen | Module Development Engineer | Intel | |
SM Shakir Mujib | Module Development Engineer | Intel | |
CE Cynthia Eluagu | Module Development Engineer | Intel | |
KS Kyle Stein | Module Development Engineer | Intel | |
MY Mohamad Yusof | Packaging Module Development Engineer | Intel | |
RQ Rommel Quintero | Packaging Module Development Engineer | Intel | |
AR Abhimanyu Reddy | Advanced Packaging Module Development Engineer | Intel | |
SM Sayoni Mitra | Module Development Engineer | Intel | |
CZ Changling Zhao | Module Development Engineer | Intel | |
VS Veerupaksh Singla | Module Development Engineer | Intel | |
AA Ayman Alghoul | Module Development Engineer | Intel |