Contacts
Likely to Engage Contact 
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Location
Contact Name | Contact Details | Job Title | Company Name |
|---|---|---|---|
ST Swee Chin Tam | Intel Module Repair Development Engineer | Intel | |
SK Sara Kaalberg | Module Development Engineer | Intel | |
IE Ifeadikachukwu Ezenwaka | Module Development Engineer | Intel | |
MA Mina Aziziha | Ltd Module Development Engineer | Intel | |
AP Adity Pore | Module Development Engineer | Intel | |
CL Corey Logston | Packaging Module Development Engineer | Intel | |
MG Monishah Gunaseelan | Packaging Module Development Engineer | Intel | |
YX Yeoh Xin | Capillary Underfill Technology Development Module Engineer | Intel | |
AZ Anqi Zhang | Sptd Packaging Module, Laser Team Development Engineer | Intel | |
MN Mindika Nayakasinghe | Ltdm Litho Module Development Engineer | Intel | |
VK Vu Kieu | Packaging Module Development Engineer | Intel | |
SS Syahmi Shafidin | Packaging Module Development Engineer | Intel | |
MB Mitun Bhoumick | Module Development Engineer | Intel | |
SL Simon Luo | Ltd Litho Module Development Engineer | Intel | |
RL Ruiyu Li | Module Development Engineer | Intel | |
AK Arun Kuruvila | Module Development Engineer | Intel | |
RM Randy Matos | Watd Module Development Engineer | Intel | |
OA Oluwole Ajumobi | Module Development Engineer | Intel | |
HA Haneen Abusharkh | Logic Technology Development Module Metal Deposition Engineer | Intel | |
SC Sanket Chhajed | Module Development Engineer | Intel |