SlicingTech

SlicingTech specializes in contract wire saw wafer slicing, offering both diamond wire and slurry cutting services for high precision, high volume needs. They utilize state-of-the-art Meyer Burger slicing systems to accommodate a variety of materials, including quartz, silicon, and specialty crystals. With over 40 years of experience, SlicingTech p... rovides efficient deliveries and excellent surface finishes, often eliminating the need for additional machining. Their services cater to industries such as optical components, medical, aerospace, and semiconductor consumables, with a global customer base across the United States, Europe, Asia, and the Middle East.Read More