HANMI Semiconductor
Electronics · South Korea · 501-1,000 Employees
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Overview
Headquarters
14 Gajwa-ro 30 Beon-gil, Incheon, South ...Phone Number
+82 325719100Website
www.hanmisemi.comRevenue
$151.1 MillionStock Symbol
042700Industry
ZI Rank: 1
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About HANMI Semiconductor
Hanmi Semiconductor is a global leader in advanced semiconductor packaging equipment. The company specializes in a wide range of products including HBM TC Bonders, 2.5D TC Bonders, FC Bonders, and various laser and grinding technologies. Their intended clients are businesses in the semiconductor industry looking for high-quality packaging solutions. Hanmi Semiconductor is committed to innovation and quality management, ensuring they meet the needs of their customers.Explore more
HANMI Semiconductor Org Chart
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Company Profile Activity
Activity Insights
HANMI Semiconductor is experiencing very low activity levels compared to other companies in the Manufacturing sector.
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HANMI Semiconductor is drawing exceptional interest within the Manufacturing industry, suggesting notable developments or strong market momentum, learn more about HANMI Semiconductor.
HANMI Semiconductor Tech Stack
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HANMI Semiconductor News & Media
Hanwha Semitech and Hanmi Semiconductor escalate HBM equipment patent dispute
Korean media have confirmed that Hanwha Semitech, previously sued by Hanmi Semiconductor for patent infringement, has now filed a counter-lawsuit against Hanmi, accusing Hanmi's HBM TC Bonder core technology of infringing its patents.Hanmi Semiconductor expands into advanced chip packaging for AI era
Hanmi Semiconductor, a rising force in semiconductor equipment manufacturing, is rapidly expanding its influence in the AI hardware ecosystem. After establishing dominance in the critical thermal compression bonding (TCB) segment used for high-bandwidth memory (HBM), the company has now officially entered the advanced system semiconductor packaging market.SEMICON Taiwan 2025: Hanmi Semiconductor unveils large 2.5D packaging equipment
The rising demand for AI servers and high-end GPUs has fueled growth in large-size 2.5D interposers, and Hanmi Semiconductor is moving quickly to capture this opportunity. At SEMICON Taiwan 2025, the South Korean company debuted its "2.5D big-die TC/FC bonder," designed for AI chips and capable of packaging interposers up to 120mm x 120mm—over six times larger than conventional semiconductor sizes.Hanmi Semiconductor says hybrid bonders too costly for HBM4, HBM5 production
Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company defends its market-leading position against rising competition.
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Hanmi Semiconductor is a global leader in advanced semiconductor packaging equipment. The company specializes in a wide range of products including HBM TC Bonders, 2.5D TC Bonders, FC Bonders, and various laser and grinding technologies. Their intended clients are businesses in the semiconductor industry looking for high-quality packaging solutions... Read More
