3S Silicon Tech

3S is established in 1998, headquartered in Hsinchu, with branch offices and sales offices in Shanghai, Singapore, Philippines and Malaysia. Today, 3S is a niche market leader in Die Bonder in Discrete Power Devices, such as diodes, Power MOSFET, and High Power LED. In Diode application, 3S has three major product lines: Clip die bonder, Soft solde... r and Ceramic automatic assembly machine. Clip die bonder is composed of die bonder, clip attachment and a snap reflow oven. Recently, Clip die bonder has been widely used in the package of high current power devices, owing to its obvious advantages over traditional wire bonder in the respect of contact resistance and package size. Over 90% of world's major bridge rectifiers packaging companies use 3S's clip die bonder to produce high quality products. In addition to the applications in diodes, 3S has also successfully developed High Power LED Flux Eutectic die bonder and Low Temperature Eutectic die bonder for LED lighting application. It has been proven that Flux Eutectic die bonding process has better reliability than Silver paste die bonding process, while the running cost of both processes are almost equal. The process temperature of newly developed Low temperature eutectic bonding process is under 150, and the bonding layer could be used under the temperature up to 260, minimizing lots of problems occurs from excessive heat. To be a trustworthy company, we pursue for better systems, better services and higher customer satisfaction. We listen to customers, learn from customers and provide systems, solutions and services to satisfy customer's needs. Our pursuit of innovation and development of new technology never ends, and our passion for excellence never stops. We commit to be a reliable partner to all of our clients. 3S Silicon Tech., Inc.Read More