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Contact Name  | Contact Details | Job Title | Company Name |
|---|---|---|---|
MR Miandad Rahim |  Phone Email | Vice President, MAC Application Lifecycle Management, Packaging & Deployments |  Citi |
DW Daniel Waski | PhoneEmail | Vice President, Application Engineering, Packaging (North America) |  Henkel |
AR A. Rai | PhoneEmail | Vice President, Kyndryl Consult, Packaged Applications |  Kyndryl |
SL Seungcheol Lee | PhoneEmail | In Packaging Adhesive Head of Application Engineering (APAC) | Henkel |
LK Lisa Kelly | PhoneEmail | Director, Application Engineering, Flexible & Paper Packaging | Henkel |
CZ Colleen Zielske | PhoneEmail | Director, Application Engineering, Flexible Packaging | Henkel |
TP Tionna Pinkney | PhoneEmail | Director, Applications & Packages |  The Vogue Room Foundation |
JS John Stankiewicz | PhoneEmail | Director, Application Engineering, App Metal Packaging Namx | Henkel |
CM Carman Mak | PhoneEmail | Team Lead, Packaging Application Manager |  Kingfisher |
SC Soumyadeep Chakraborty | PhoneEmail | Packaged Application Development Associate & Manager |  Accenture |
MS Ma Samson | PhoneEmail | Manager, Oracle Cloud Packaged Application Development | Accenture |
NG Nidhi Garhwal | PhoneEmail | Manager, Packaged Application Development | Accenture |
JQ Jann Quijano | PhoneEmail | Associate Manager, ERP Package Application |  DXC Technology |
BH Biswameet Hui | PhoneEmail | Packaged Application Development Team Lead | Accenture |
RM Rizki Mahesa Surakusumah | PhoneEmail | Packaged Application Development Associate & Manager | Accenture |
PL Paige LaPlaunt | PhoneEmail | Consumer Packaged Goods Applications Sales Manager |  Oracle |
AD Artika Dutt | PhoneEmail | Associate Manager, ERP Package Applications | DXC Technology |
TZ Tao Zhu | PhoneEmail | Manager, ERP Package Applications | DXC Technology |
BH Babu Henry | PhoneEmail | Team Lead, Application Packaging Appvolume SME |  TEKsystems |
SM Sathish Muthukrishnan | PhoneEmail | Manager, ERP Packaged Applications | DXC Technology |
