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Contact Name  | Contact Details | Job Title | Company Name |
|---|---|---|---|
NL Nishant Lakhera |  Phone Email | Director, Semiconductor Package Engineering |  NXP |
SM Satbir Madra | PhoneEmail | Director, Semiconductor Package Engineering & Development |  Analog Devices |
SG Srikanth Gunti | PhoneEmail | Manager, Advance Semiconductor Packaging 2 5d & 3D Product Packaging Engineering |  Intel |
RC Raelean Clark | PhoneEmail | Manager, Substrate Supplier & Semiconductor Research & Development Packaging Engineer |  Dexian |
AS Amin Sijelmassi | PhoneEmail | Semiconductor Packaging Engineer Manager |  Texas Instruments |
NG Nikhil Ganesh | PhoneEmail | Area Manager, Engineering Advanced Semiconductor Packaging | Intel |
FC Floro Camenforte | PhoneEmail | Senior Manager, Package Design Engineering (Gan Power Semiconductor) |  Renesas Electronics |
SM Sai Mylavarapu | PhoneEmail | Manager, Engineering Td Advanced Semiconductor Packaging | Intel |
HS Hank Sung | PhoneEmail | Manager, Semiconductor Packaging Engineering | Texas Instruments |
ML Michelle Lam | PhoneEmail | Semiconductor Packaging Quality Reliability Engineer | Intel |
HC Han Chien | PhoneEmail | Semiconductor Packaging Engineer | Analog Devices |
TM Thomas Moreland | PhoneEmail | Semiconductor Packaging Engineer | Texas Instruments |
JW Jaimal Williamson | PhoneEmail | Senior Semiconductor Packaging Member, Technical Staff Engineer (SMTS) | Texas Instruments |
BP Brian Parks | PhoneEmail | Semiconductor Packaging Engineer | Texas Instruments |
JP Jason Pauly | PhoneEmail | Semiconductor Packaging Engineer | Texas Instruments |
BT Babak Talebanpour | PhoneEmail | Lead Semiconductor Packaging Engineer |  Quantinuum |
SN Shiraz Nantogma | PhoneEmail | Semiconductor Packaging Research & Development Engineer | Intel |
BB Brooke Bernier | PhoneEmail | Semiconductor Packaging Engineer | Texas Instruments |
SH S. Hasan | PhoneEmail | Semiconductor Packaging Engineer | NXP |
SM Stephen Moxham | PhoneEmail | Semiconductor Package Design Engineer |  Micron |