Contacts
Likely to Engage Contact 
Contact Name And Email
Current Role
Contact Info
Companies
Company Name/URL/Ticker
Industry
Employee Count
Revenue
Locations
Location
Contact Name | Contact Details | Job Title | Company Name |
|---|---|---|---|
AW Andrew Wong | Vice President, IC Packaging Eng'g | Amkor Technology | |
TL Teng Lo | Manager, Packaging Design Engineering | Renesas Electronics | |
HC HuangMin Chu | Senior Manager, Packaging Engineering | AMD | |
DY Delia Yeh | Senior Manager, Package Process Engineering | OMNIVISION | |
YC Yi-Ting Chen | Engineering & Supplier Management Manager, Packaging | AMD | |
SC Stanley Chou | Manager, Packaging Engineering | Texas Instruments | |
MM Mike Mercado | Manager, Packaging & Assembly Engineering | pSemi | |
PK Panikumar Kallamballe | Package Engineer | Qualcomm | |
PP Peter Pi | Packaging Engineer | Compal Electronics | |
MH Mark Hsu | Senior, Packaging Engineer | MACOM | |
WL Wei-Hsiang Lien | Package Engineer | Silergy | |
NL Nita Li | Senior Packaging Engineer | Amazon Lab126 | |
CC Cm Chu | Package Engineer | Ampere | |
MT Michelle Taneo | Senior Package Product Engineer | ASE Technology | |
SP Sangwoo Park | Package Engineer | Micron | |
SW Shujung Wang | Package Cae Engineer | OMNIVISION | |
TC Tung Chen | Senior Package Engineer | TSMC | |
KW Kai Wang | Advanced Packaging & Product Integration Staff Engineer | Micron | |
SY Stanley Yeh | Package Staff Development Engineer | InvenSense | |
JW Jessica Wang | IC Package Design Engineer | MediaTek |