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Contact Name  | Contact Details | Job Title | Company Name |
|---|---|---|---|
VM Vernon Murray |  Phone Email | President, Assembly Technologies |  Emerson |
BC Benny Camilleri | PhoneEmail | INDS Sub Assembly Productuion Scheduler and Controller |  Aristocrat Gaming |
TL Thabo Legwabe | PhoneEmail | Assembly Controller |  iCAM Video Telematics |
DS Darren Sekiguchi | PhoneEmail | Program Management, Supply Chain, Assembly & Autonomous Data, Prime Air Managing Director, Marketing |  Amazon |
JM Justin BK Min | PhoneEmail | Vice President and Head, National Assembly Team |  Coupang |
NG Nasser Grayeli | PhoneEmail | Director, Assembly Technology Development |  Intel |
RM Ryan Mercer | PhoneEmail | Director, Assembly Operations |  Fives Group |
TS Tushar Sehgal | PhoneEmail | Assembly Director, Manufacturing |  Bluedrop Training & Simulation |
TP Timothy Pittler | PhoneEmail | Head Stock Assembler | Fives Group |
KT Keith Tan | PhoneEmail | Director, Assembly & Packaging Engineering |  Broadcom |
CD Craig Dunning | PhoneEmail | Director, Advanced Packaging Assembly Engineering | Intel |
EG Emily Gibbons | PhoneEmail | Director, Supply Chain, Mechanical Assemblies |  Honeywell Technologies |
HW Holly Williams | PhoneEmail | Caucus and Assembly Director |  Reagan |
BK Brian Katz | PhoneEmail | Senior Director Advanced and Assembly Packaging Materials | Intel |
MF Mordi Farkash | PhoneEmail | Senior Director, Manufacturing Technologies & Electro-Optic Products Assembly |  NVIDIA |
BF Behzad Fathi | PhoneEmail | Director of Assembly Affairs |  Hezardastan Group |
CR Christopher Rumer | PhoneEmail | Director, Assembly Engineering | Intel |
VS Venugopal Sharma | PhoneEmail | Deputy General Manager-Sub Assembly |  Hindustan Aeronautic |
AM Alexey Mazur | PhoneEmail | Руководитель сборочного участка / Head assembly area |  Siemens |
TO Tyler Osborn | PhoneEmail | Director, Wafer Assembly Technology Development | Intel |
