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Contact Name  | Contact Details | Job Title | Company Name |
|---|---|---|---|
AO Amit Oren |  Phone Email | Director of Chief People Officer Package Engineering |  NVIDIA |
MT Mao-Feng Tseng | PhoneEmail | Advanced Packaging Process Engineer - Chief Technology Officer Office |  Applied Materials |
RT Ryan Thorpe | PhoneEmail | Vice President, Package Engineering |  iDEAL Semiconductor |
SL Steven Lee | PhoneEmail | Vice President, Packaging Engineering |  Chipletz |
TM Thomas Matway | PhoneEmail | Vice President & General Manager, AMETEK Engineered Materials - Interconnects and Packaging |  AMETEK |
ST Steven Thumbeck | PhoneEmail | Sales Director, Engineered Interconnect & Packaging |  AMETEK Engineered Interconnect and Packaging |
RM Richard McCann | PhoneEmail | Director, Package Engineering |  Rochester Electronics |
DC Daniel Cardoso | PhoneEmail | Division Engineered Materials, Interconnects & Packaging Director, Information Technology (Emip) | AMETEK |
ML Mary LaMacchia | PhoneEmail | Director, Packaging Engineering & Design |  PopSockets |
CR Corey Reichman | PhoneEmail | Director, Package Engineer |  Amkor Technology |
RR Ruther Ricon | PhoneEmail | Director, Package Development Engineering |  Renesas Electronics |
JH Jung Han | PhoneEmail | Director. Principal Engineer. Area Manager. Advanced Packaging Development |  Intel |
BB Brian Belknap | PhoneEmail | Global Senior Director, Tooling, Manufacturing Development & Packaging Engineering |  Sonos |
KF Kevin Fortier | PhoneEmail | Senior Director, Package Engineering |  nLIGHT |
EL Efren Lacap | PhoneEmail | Director, Packaging Engineering & Supplier Liasion |  ACCO |
SD Sriram Dattaguru | PhoneEmail | Director, Supplier Engineering, Substrate Packaging Technology Development |  Intel Japan |
NL Nishant Lakhera | PhoneEmail | Director, Semiconductor Package Engineering |  NXP |
SP Srinivas Pietambaram | PhoneEmail | Principal Engineer & Director, Advanced Packaging Research & Development | Intel |
ST Sri Tharumalingam | PhoneEmail | Senior Director, IC Package Development & Assembly Engineering | Renesas Electronics |
KT Keith Tan | PhoneEmail | Director, Assembly & Packaging Engineering |  Broadcom |