Contacts
Likely to Engage Contact 
Contact Name And Email
Current Role
Contact Info
Companies
Company Name/URL/Ticker
Industry
Employee Count
Revenue
Locations
Location
Contact Name | Contact Details | Job Title | Company Name |
|---|---|---|---|
MT Mao-Feng Tseng | Advanced Packaging Process Engineer - Chief Technology Officer Office | Applied Materials | |
RT Ryan Thorpe | Vice President, Package Engineering | iDEAL Semiconductor | |
SL Steven Lee | Vice President, Packaging Engineering | Chipletz | |
TM Thomas Matway | Vice President & General Manager, AMETEK Engineered Materials - Interconnects and Packaging | AMETEK | |
AW Andrew Wong | Vice President, IC Packaging Eng'g | Amkor Technology | |
JG Jesse Galloway | Vice President, Advanced Package Engineering | Amkor Technology | |
SP Srinivas Pietambaram | Principal Engineer & Director, Advanced Packaging Research & Development | Intel | |
ST Sri Tharumalingam | Senior Director, IC Package Development & Assembly Engineering | Renesas Electronics | |
KT Keith Tan | Director, Assembly & Packaging Engineering | Broadcom |