Contacts
Likely to Engage Contact 
Contact Name And Email
Current Role
Contact Info
Companies
Company Name/URL/Ticker
Industry
Employee Count
Revenue
Locations
Location
Contact Numbers and Email Addresses of B2B Business Professionals
Powered by 
Contact
Company
Browse Verified Professional Emails and Phone Numbers – Accurate & Up-to-Date
Build targeted lists and connect with verified professionals using ZoomInfo’s contact database. With over 209 million professional profiles and 13 million businesses, we offer more verified email addresses and direct phone numbers than any other market intelligence platform.
Contact Name  | Contact Details | Job Title | Company Name |
|---|---|---|---|
TM Thomas Matway |  Phone Email | Vice President & General Manager, AMETEK Engineered Materials - Interconnects and Packaging |  AMETEK |
JH Jung Han | PhoneEmail | Director. Principal Engineer. Area Manager. Advanced Packaging Development |  Intel |
SJ Samuel Jiang | PhoneEmail | Senior Manager, Principal Packaging Engineer |  Lightelligence |
PH Paul Hogan | PhoneEmail | Manager, Packaging Engineering (Microelectronics) |  MACOM |
JC Johnny Chen | PhoneEmail | Senior Manager, Principal Packaging Engineer | Lightelligence |
TL Teng Lo | PhoneEmail | Manager, Packaging Design Engineering |  Renesas Electronics |
FT Fábio Tadeu | PhoneEmail | Manager, Packaging Backend Engineering |  Zilla Technologies |
MH Michelle Hazard | PhoneEmail | Senior Manager, Package Engineering |  Microchip Technology |
YK Yothin Komchuad | PhoneEmail | Senior Manager, IC Packaging Engineering |  Stars Microelectronics |
GY George Ye | PhoneEmail | Senior Manager, Packaging & Engineering |  NXP |
CW Cy Wong | PhoneEmail | Manager, Packaging Engineering |  Advanced Energy |
RL Rogério Largi | PhoneEmail | Manager, Engineering Process Equipment Maintenance (IC Packaging Semiconductors) | Zilla Technologies |
HC HuangMin Chu | PhoneEmail | Senior Manager, Packaging Engineering |  AMD |
CW Craig Wiser | PhoneEmail | Manager, Packaging Engineering |  Bose |
DY Delia Yeh | PhoneEmail | Senior Manager, Package Process Engineering |  OMNIVISION |
ML Mun Loy | PhoneEmail | Senior Manager, Package Development Engineering |  Micron |
MR Mihir Roy | PhoneEmail | Manager, Engineering Packaging |  Synaptics |
UV Udayan Verma | PhoneEmail | Manager, Engineering Td (Substrates Packaging Technology Development) | Intel |
RM Ramkrishna Mamidi | PhoneEmail | Associate Manager, Packaging Engineering |  TE Connectivity |
VS Vish Sundararaman | PhoneEmail | Manager, Packaging Engineering |  Texas Instruments |
