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Contact Name  | Contact Details | Job Title | Company Name |
|---|---|---|---|
BF Bradley Ferguson |  Phone Email | Senior Vice President and General Manager, Special Programs. Senior Vice President, SkyWater Florida. General Manager, Advanced Packaging. President and Chief Executive Officer, SkyWater Federal |  SkyWater Technology |
PL Phill LoPresti | PhoneEmail | Managing Director, Business Corporate Development Advanced Packaging & Icaps |  Applied Materials |
RW Ruiping Wang | PhoneEmail | Group Managing Director, Advanced Packaging Business Unit, Silicon Product | Applied Materials |
TT Thirumal Thanigaivelan | PhoneEmail | Line Management, Laser Anneal & Advanced Packaging Lithography Vice President, Product |  Veeco |
AG Andrew Goh | PhoneEmail | Corporate Vice President and General Manager, South East Asia. World-wide Advance Packaging Customer Operation |  Lam Research |
DP Deenesh Padhi | PhoneEmail | Vice President and General Manager of Advanced Packaging Business Unit | Applied Materials |
TM Thomas Matway | PhoneEmail | Vice President & General Manager, AMETEK Engineered Materials - Interconnects and Packaging |  AMETEK |
PP Przemyslaw Pazdzior | PhoneEmail | Vice President and General Manager Electrification Packaging Solutions North America |  ABB |
DS Devesh Shah | PhoneEmail | Division Head of Sales, Marketing & Business Line Manager Packaging-System Drives (India) | ABB |
JK Jr Khan | PhoneEmail | Deputy General Manager (Electronics Packaging) |  Amphenol |
TA TaiKun An | PhoneEmail | QRA Director and Package Introduction Managing |  Onsemi |
KT Koichi Takemura | PhoneEmail | General Manager, Optical Packaging |  AIO Core |
HM Himadri Mukhopadhyay | PhoneEmail | Deputy General Manager, Packaging & Strategic Procurement |  Havells |
YM Yasutaka Mizomoto | PhoneEmail | General Manager and Advanced Package |  Tokyo Electron |
BS Balvir Solanki | PhoneEmail | Assistant General Manager Packaging Develpment | Havells |
NC Nuits Chi | PhoneEmail | Package Manager |  HoMedics USA |
JH Jung Han | PhoneEmail | Director. Principal Engineer. Area Manager. Advanced Packaging Development |  Intel |
CC Cs Chu | PhoneEmail | Submicron, Packaging & Plating Senior Director, Product Management |  Besi |
MM Matt Murphy | PhoneEmail | Director, Global Category & Operational Indirect Manager, Packaging |  Energizer Holdings |
SL Shin Low | PhoneEmail | Director, Assembly Packaging & Supplier Management |  AMD |
