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Likely to Engage Contact 
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Location
Contact Name | Contact Details | Job Title | Company Name |
|---|---|---|---|
GC Gregory Caruyer | Senior Director, Device & Process Integration Engineering | Qorvo | |
DL Da-Wen Lin | Device Integration Engineer & Director | TSMC | |
AK Aloka Khanna | Director, Engineering (Device, Product, Integration & Yield) | Intel | |
ZZ Zoma Zaman | Manager, Device Integration Engineering | Samsung | |
DT Deepak Thimmegowda | Manager, Device, Integration, Design Collaterals & Customer Engineering | Intel | |
VK Vikas Kaushal | Senior Manager II, Staff Device Integration Engineering | Samsung | |
TS Tim Smith | Ptd Module & Integration Device Engineer | Intel | |
PS Priscila Spagnol | Senior Device, Integration & Yield Enhancement III- Technology Engineer V | NXP | |
TK Tae-Hoon Kim | MTS Integration & Device Engineer | GlobalFoundries | |
ND Neithan Dominick | Process Integration Device & Yield Engineer | Intel | |
JB Joseph Brice | Ptd Module & Integration Device Yield Engineer | Intel | |
KA Koley Arijit | Ptd Module & Integration Device Yield Engineer | Intel | |
SB Shelby Behnke | Ptd Module & Integration Device Yield Engineer | Intel | |
HC Huang Creasy | Eng'R Principal (Device & Process Integration) | Infineon Technologies | |
OL Olivia Luetge | Device Integration & Yield Engineer | NXP | |
KH Kijeong Han | Power Device Design & Process Integration Engineer | Renesas Electronics | |
AK Ankur Korad | Process Integration & Device Engineer | Intel | |
MY Miad Yarali | Device Integration Engineer | Samsung | |
AP Abhishek Parija | Staff Process Integration & Device Engineer | Intel | |
NW Nick Winters | Staff Device Integration Engineer | Diodes |