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Contact Name  | Contact Details | Job Title | Company Name |
|---|---|---|---|
Armstrong Jian |  Phone Email | Chief Technology Officer, Application Engineering Department |  Allystar Technology |
Tomasz Mokrzan | PhoneEmail | Senior Radio Frequncy Application Engineer & President |  T&C Power Conversion |
JC Joe Chuang | PhoneEmail | Optical Inspection Application Engineer & Chief Technology Officer, Engineered Optics Team, Office of |  Applied Materials |
SM Shaun Moore | PhoneEmail | Chief Technology Officer & Applications Engineer |  TRM Microwave |
JG Jeremiah Golston | PhoneEmail | Executive VP, Engineering & Application Processor Technology |  Qualcomm |
NB Neil Bradshaw | PhoneEmail | Vice President, Americas & Director, Applications Engineering |  Xiamen Hithium New Energy |
CH Craig Hardin | PhoneEmail | Vice President, Worldwide Channel & Field Applications Engineering |  Allegro MicroSystems |
JR Jerry Rudiak | PhoneEmail | Vice President, Applications Engineering |  iDEAL Semiconductor |
AS Amit Shaligram | PhoneEmail | Applications Engineering Vice President, Marketing |  StMicroelectronics |
SZ Shengke Zhang | PhoneEmail | Vice President, Reliability & Field Application Engineering |  Efficient Power Conversion |
SS Scott Schube | PhoneEmail | Business Development, Signal Integrity Products Vice President, Application Engineering |  Semtech |
SA Sergio Angeli | PhoneEmail | Senior VP, Field Applications Engineering |  GRID20/20 |
JJ Jackie Johnson | PhoneEmail | Vice President, Application Engineering |  Qorvo |
PS Palani Subbiah | PhoneEmail | Vice President, Applications Engineering |  Onsemi |
YH Yoshinobu Higuchi | PhoneEmail | Product Marketing Vice President, Application Engineering |  Greenliant Systems |
VJ Vachik Javadian | PhoneEmail | Global Vice President, Applications Engineering |  ERP Power |
SW Shen Wang | PhoneEmail | Display Solutions Vice President, Applications Engineering |  OMNIVISION |
WG Wenzhe Gao | PhoneEmail | Associate VP, Application Engineering |  Credo |
VP Vinayak Pandey | PhoneEmail | Marketing & Field Application Engineering Vice President, Product Technology |  STATS ChipPAC Ltd. |
BG Benjamin Gan | PhoneEmail | Vice President, Applications & Engineering |  NXP |