Contacts
Likely to Engage Contact 
Contact Name And Email
Current Role
Contact Info
Companies
Company Name/URL/Ticker
Industry
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Location
Contact Name | Contact Details | Job Title | Company Name |
|---|---|---|---|
SP Srinivas Pietambaram | Principal Engineer & Director, Advanced Packaging Research & Development | Intel | |
CD Craig Dunning | Director, Advanced Packaging Assembly Engineering | Intel | |
LM Liane Martinez | Director, Packaging Engineering | AMD | |
RM Ramon Mitra | Director, Package Development & Engineering | Micron | |
GD Gang Duan | Principal Engineer & Director, Engineering Substrate Packaging Backend Area | Intel | |
ML Mary LaMacchia | Director, Packaging Engineering & Design | PopSockets | |
RN Raynard Neo | Director, Package Reliability Engineering | Micron | |
DT Donald Templeton | Director, Hardware Engineering IC Packaging | NVIDIA | |
TL Teng Lim | Director, Packaging Engineering | AMD |