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Contact Name  | Contact Details | Job Title | Company Name |
|---|---|---|---|
KW Kevin Wiederhold |  Phone Email | Director, Module Engineering |  GlobalFoundries |
AH Ang Huat | PhoneEmail | Director, Fab Operation Module Engineering & Merology | GlobalFoundries |
AV Alok Vaid | PhoneEmail | Director, Advanced Module Engineering | GlobalFoundries |
SU Shamas Ummer | PhoneEmail | Director, Module Integration Engineering |  Samsung |
CN Coumba Ndoye | PhoneEmail | Senior Director, Module Engineering | GlobalFoundries |
KT Kin Tang | PhoneEmail | Senior Director, Module Engineering | GlobalFoundries |
PZ Paul Zipp | PhoneEmail | Senior Director, Dram Compute Product & Module Development Systems Engineering |  Micron |
KC Koh Chuah | PhoneEmail | Senior Director, Advance Module Engineering | GlobalFoundries |
MI Mohd Ismail | PhoneEmail | Manager, Section Module Engineering Photolithography (Shift & Manager, Globalfoundries (Malaysia) | GlobalFoundries |
BH Brandon Harper | PhoneEmail | Manager, Module Engineering |  Intel |
SG Saurabh Gosewade | PhoneEmail | Manager, Module Engineering Backside Grind & Metal | Intel |
MB MacKenzie Beck | PhoneEmail | Manager, Module Engineering Physical Vapor Deposition | GlobalFoundries |
RA Riad Alzghier | PhoneEmail | Manager, Module Development Engineering | Intel |
SA Sandip Argekar | PhoneEmail | Manager, Module Development Engineering | Intel |
RS Rajhan Said | PhoneEmail | Manager, Module Engineering | Intel |
SR Sandy Riemer | PhoneEmail | Manager, Module Engineering | Intel |
DE Dominic Esan | PhoneEmail | Manager, Module Development Engineering | Intel |
EF Eddie Facyson | PhoneEmail | Manager, Module Engineering | Intel |
BC Brian Chapler | PhoneEmail | Manager, Td Module & Integration Yield Engineering | Intel |
RC Raghu Chilkunda | PhoneEmail | Engineering Modules Manager, Infrastructure | Intel |
