Contacts
Likely to Engage Contact 
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Location
Contact Name | Contact Details | Job Title | Company Name |
|---|---|---|---|
RA Ryan Alderfer | Senior Hardware Electronics Packaging Research & Development For Aircraft Electronics Mechanical Engineer | Lockheed Martin | |
BG Behnam Garakani | Research & Development Electronic Packaging Engineer | Dexian | |
AC Amelia Cherian | Electronics Packaging Engineer | Johns Hopkins University Applied Physics Laboratory | |
GM Gregory Merboth | Electronics Packaging Engineer | Johns Hopkins University Applied Physics Laboratory | |
DB Darryl Becker | Electronic Packaging Engineer | IBM | |
DC Daniruth Chhiv | Mechanical Engineer - Electronic Packaging | MDA Space | |
TS Thomas Silvers | Electro Mechanical Engineer, Electronic Packaging | Lockheed Martin | |
CC Christopher Craddock | Electronics Packaging Senior Project Engineer | Lockheed Martin | |
BB Bryan Baraclough | Electronics Packaging Engineer | Lockheed Martin | |
RT Russell Tartock | Electronics Packaging Mechanical Design Engineer | Entegee | |
LY Liang Yin | Electronic Packaging Engineer | GE Research | |
SC Stevan Cvetanovic | Mechanical & Electronics Packaging Design Engineer | Lockheed Martin | |
BQ Brian Quinlan | Electronic Packaging Development Engineer | IBM | |
SE Stanley Eckert | Senior Electronic Packaging Engineer | IBM | |
JV Jeannette Van Sickle | Electronics Packaging Engineer | Johns Hopkins University Applied Physics Laboratory |