What is Xernus?
Xernus Corporation is a seasoned industry leader with over 21 years of specialized expertise in Probe Card assembly, Probe Interface Board (PIB) assembly, Device Under Test (DUT) assembly, Device Interface Board (DIB) assembly, Load Board assembly, and Handler Interface Board (HIB) assembly. The company has consistently demonstrated a commitment to maintaining its leadership position through substantial investments in state-of-the-art equipment. Xernus operates as a sole proprietorship, emphasizing its financial stability and sound operational footing. With a history of strategic expansion, including four previous moves that doubled its workspace and equipment investment, Xernus serves a global clientele under strict non-disclosure agreements, ensuring robust protection of customer data. Beyond its core assembly services, key personnel bring an additional 16 years of experience in Printed Circuit Board fabrication and 8 years in Microwave assembly, contributing to enhanced product quality and reliability.
How much funding has Xernus raised?
Xernus has raised a total of $150K across 1 funding round:
Debt
$150K
Debt (2020): $150K with participation from PPP
Key Investors in Xernus
PPP
Public-Private Partnership
What's next for Xernus?
The recent major strategic investment signals Xernus's readiness for its next phase of growth, likely focused on expanding its advanced manufacturing capabilities and potentially exploring new market segments. Given its extensive experience and commitment to technological advancement, this capital infusion is poised to accelerate its innovation in probe card and interface board solutions, reinforcing its global service offerings and competitive edge in the semiconductor test industry.
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