What is Xernus?
Xernus Corporation has established itself as a leader in Probe Card assembly, Probe Interface Board (PIB) assembly, Device Under Test (DUT) assembly, Device Interface Board (DIB) assembly, Load Board assembly, and Handler Interface Board (HIB) assembly. With over 21 years of industry experience, the company prides itself on investing in state-of-the-art equipment to maintain its competitive edge. Xernus is characterized by its financial stability and has demonstrated growth through strategic relocations that have consistently doubled its workspace and equipment investment. Serving a global clientele, the company operates under strict Non-Disclosure Agreements, ensuring the confidentiality and protection of customer intellectual property. Its key personnel also bring extensive experience in Printed Circuit Board fabrication and Microwave assembly, enhancing product quality and reliability.
How much funding has Xernus raised?
Xernus has raised a total of $150K across 1 funding round:
Debt
$150K
Debt (2020): $150K with participation from PPP
Key Investors in Xernus
PPP
Public-Private Partnership
What's next for Xernus?
The recent strategic investment, a significant debt financing, positions Xernus to further enhance its manufacturing capabilities and potentially expand its service offerings in the highly specialized field of semiconductor testing components. Given its 'large-scale late-stage funding' context and long operational history, Xernus is likely focused on optimizing its supply chain, upgrading its advanced manufacturing infrastructure, and solidifying its relationships with key global clients. This capital infusion will support its ongoing commitment to technological advancement and operational excellence in a demanding industry.
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