What is SJ Semiconductor Co?
Headquartered in Jiangyin, Jiangsu province, SJ Semiconductor Co operates as China's first 300mm MEOL foundry. Since its founding in 2014, the company has specialized in advanced Bumping and wafer-level packaging (WLP), providing essential manufacturing support for smartphone application processors, advanced DRAM, and power management chips. By bridging the gap between front-end wafer fabrication and back-end assembly, SJSemi has established itself as a cornerstone of the regional semiconductor ecosystem, enabling the production of highly integrated and efficient electronic components.
How much funding has SJ Semiconductor Co raised?
SJ Semiconductor Co has raised a total of $1B across 2 funding rounds:
Series C
$300M
Other Financing Round
$700M
Series C (2021): $300M with participation from Huatai International Private Equity Fund
Other Financing Round (2024): $700M led by China Life, Shanghai International Group, Fortera Capital, and Shanghai Lingang Economic Development (Group
Key Investors in SJ Semiconductor Co
China Life
China Life Insurance is a prominent domestic insurance provider headquartered in Beijing, offering a comprehensive suite of financial protection services including life, medical, and accident insurance.
Shanghai International Group
Shanghai International Group is a state-owned financial platform that manages a diverse portfolio of assets across banking, securities, and insurance to promote the development of the real economy.
Fortera Capital
Fortera Capital is a specialized investment firm operating within the venture capital and private equity sectors, focusing on high-growth opportunities in the technology and industrial landscape.
What's next for SJ Semiconductor Co?
With the successful closure of this major strategic investment, SJ Semiconductor Co is well-positioned to accelerate its technological roadmap and scale its production capacity. The capital will likely be deployed toward enhancing its 28/14nm bumping capabilities and further refining its WLP processes to meet the increasing demand for high-density chip integration. As the industry shifts toward more complex heterogeneous integration, SJSemi's focus on MEOL innovation will be vital for maintaining its competitive edge. The company is expected to leverage this financial backing to solidify its infrastructure, attract top-tier engineering talent, and expand its footprint within the global semiconductor supply chain, ensuring it remains at the forefront of advanced packaging solutions.
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