What is Si2 Microsystems?
Si2 Microsystems specializes in delivering comprehensive turnkey Systems and SiP (System-in-Package) solutions. The company integrates advanced System & Chip design capabilities with robust Manufacturing Technology. Si2 operates through three distinct business divisions: ASiP, focusing on customer-specific SiP solutions; FSiP, offering standard and semi-custom SiP solutions for wireless applications; and ODM, a manufacturing business leveraging design expertise in telecommunication systems and SDRAM Memory Modules. Their solutions cater to a global clientele across commercial, military, and space applications, utilizing SiP technology, ASIC Design, System Engineering, and in-house manufacturing to optimize form-factor, price, and time-to-market.
How much funding has Si2 Microsystems raised?
Si2 Microsystems has raised a total of $12.7M across 1 funding round:
Unspecified
$12.7M
Unspecified (2009): $12.7M with participation from VenturEast and JAFCO Asia
Key Investors in Si2 Microsystems
VenturEast
VenturEast is an investment firm that has participated in Si2 Microsystems' funding rounds. Further details on their specific investment focus or sector specialization are not provided in the input data.
JAFCO Asia
JAFCO Asia, soon to be rebranded as JIF Capital, specializes in venture capital investment across the Asia Pacific region, leveraging over 25 years of expertise. The company focuses on maximizing return on investment through dedicated business development and financial skills, catering to both investors and entrepreneurs. With a global presence and local expertise, JAFCO Asia aims to create enduring value and advance opportunities for its clients. The firm is involved in various sectors including technology, healthcare, and clean tech, adapting to the evolving market needs.
What's next for Si2 Microsystems?
The recent major strategic investment in Si2 Microsystems signals a pivotal moment for the company, likely enabling accelerated development of its advanced SiP and system manufacturing capabilities. This infusion of capital is expected to bolster its competitive edge in providing co-designed solutions optimized for demanding applications in telecommunications, defense, and aerospace. The company's focus on integrating design expertise with manufacturing infrastructure positions it for continued expansion and technological leadership in the semiconductor industry.
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