How Much Did Oshkosh Plating Technologies Raise?
Funding & Key Investors

Oshkosh Plating Technologies has secured $1.5M in total capital, with its most recent financing round bringing in $310K in a major strategic investment. This latest infusion of capital underscores the company's significant enterprise-level funding trajectory.

What is Oshkosh Plating Technologies?

Oshkosh Plating Technologies
ManufacturingIndustrial Machinery & Equipment

Oshkosh Plating Technologies, Inc. is a specialized provider of metal finishing services, operating both RACK and BARREL line processes. The company's RACK line is engineered to accommodate exceptionally large components, with a capacity for parts up to 110 inches long, 58 inches high, and 30 inches wide, weighing up to 250 pounds. This capability allows for the zinc plating of very large and non-uniform parts. Complementing this is a 16x30 manual BARREL line, designed for production runs of varying sizes while maintaining a stringent focus on quality. Oshkosh Plating Technologies also offers baking services to mitigate hydrogen embrittlement, a critical step in preserving the integrity of plated materials.

How much funding has Oshkosh Plating Technologies raised?

Oshkosh Plating Technologies has raised a total of $1.5M across 3 funding rounds:

2020

Debt

$150K

2024

Debt

$1M

Debt

$310K

Debt (2020): $150K with participation from PPP

Debt (2024): $999K led by Horicon Bank

Debt (2024): $310K supported by Horicon Bank

Key Investors in Oshkosh Plating Technologies

Horicon Bank

Horicon Bank is a financial institution likely providing debt financing and banking services to regional businesses, supporting their operational growth and capital expenditure needs.

PPP

Public-Private Partnership

Horicon Bank

Horicon Bank, a key financial partner, has provided significant debt financing, indicating a strong relationship and confidence in Oshkosh Plating Technologies' financial stability and future prospects.

What's next for Oshkosh Plating Technologies?

The recent major strategic investment signifies a pivotal moment for Oshkosh Plating Technologies, indicating a strong market confidence in its operational capabilities and growth potential. This substantial backing, particularly from entities like Horicon Bank, suggests a focus on expanding capacity, enhancing technological infrastructure, or pursuing new market segments within the industrial plating and metal finishing sector. The company is well-positioned to leverage this financing to solidify its market position and drive further innovation in its specialized services.

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Frequently Asked Questions Regarding Oshkosh Plating Technologies Financial Insights

What are the most recent funding rounds that Oshkosh Plating Technologies has completed, and what were the funding rounds?
Oshkosh Plating Technologies has recently completed 3 funding rounds: Debt on Dec 31, 2024, Debt on Sep 30, 2024, Debt on Apr 7, 2020.
What is the total amount of funding Oshkosh Plating Technologies has raised to date?
Oshkosh Plating Technologies has raised a total of $1.5M in funding to date.
How many funding rounds has Oshkosh Plating Technologies completed?
Oshkosh Plating Technologies has completed 3 funding rounds.
How much funding did Oshkosh Plating Technologies raise in its most recent funding round?
Oshkosh Plating Technologies raised $310K in its most recent funding round.
Who are the lead investors in Oshkosh Plating Technologies's latest funding round?
The lead investor in Oshkosh Plating Technologies's latest funding round was Horicon Bank. To access investor data and explore similar companies, sign up for ZoomInfo.
Which was the largest funding round in Oshkosh Plating Technologies's history?
The largest funding round in Oshkosh Plating Technologies's history was $999K.
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