What is Exatron?
Exatron provides an innovative technology for making electrical contact to semiconductor devices, primarily through its Diamond Particle Interconnect (PI) contacts. These contacts are engineered for high-performance interconnects between surface mount devices and load boards, testers, and programmers, as well as other repeat-insertion applications. The PI technology offers an exceptionally low interconnect of as little as 0.001" between the DUT lead and test circuit trace. Notably, PI is the only contactor method that achieves effectively ZERO INDUCTANCE, CAPACITANCE, and RESISTANCE, boasting a lifespan of up to 1 million insertions. This superior performance effectively eliminates the impedance mismatch often experienced with conventional contactor assemblies, as PI contacts exhibit electrical characteristics akin to a solder connection. The Particle Interconnect system utilizes metalized diamond particles to form a micro "bed of nails" contact, piercing contaminants on DUT leads or test contacts to achieve a resistance of under 3 milliOhms, with variations dependent on the specific application.
How much funding has Exatron raised?
Exatron has raised a total of $585K across 1 funding round:
Debt
$585K
Debt (2021): $585K with participation from PPP
What's next for Exatron?
The recent major strategic investment in Exatron signals a strong validation of its unique Diamond Particle Interconnect technology and its potential to disrupt the semiconductor testing and interconnect market. With a focus on zero-inductance, zero-capacitance, and zero-resistance solutions, Exatron is well-positioned for significant growth and expansion. This capital infusion is expected to fuel further research and development, enhance manufacturing capabilities, and broaden market penetration into high-frequency and high-reliability applications. The company's trajectory suggests a move towards scaling its operations to meet increasing demand for its advanced contact solutions.
See full Exatron company page
