Leadership Overview
Unisem has 8 executives leading key functions including strategy, operations, and sales.
Driven by innovation, Unisem provides integrated semiconductor assembly and test services, impacting global electronics manufacturing through advanced packaging and testing solutions.
Driven by innovation, Unisem provides integrated semiconductor assembly and test services, impacting global electronics manufacturing through advanced packaging and testing solutions.
Leadership Roles at Unisem
Bruno Guilmart - Chief Executive Officer
Bruno Guilmart, the Chief Executive Officer at Unisem, directs the company's overall strategic vision and operational execution. Guilmart oversees all facets of Unisem's business, ensuring alignment with market demands for semiconductor assembly and test services. This leadership encompasses driving growth initiatives and maintaining Unisem's competitive edge in the OSAT sector. The Chief Executive Officer's purview includes fostering innovation in packaging and test technologies, such as wafer bumping and substrate IC packaging. Guilmart ensures the company's integrated suite of services, from wafer probing to RF, analog, and digital test, meets stringent industry standards. By guiding corporate development, Bruno Guilmart solidifies Unisem's position as a premier provider of advanced semiconductor solutions.
Sh Quek - Chief Operating Officer
Sh Quek, the Chief Operating Officer at Unisem, manages the day-to-day operational activities critical to Unisem's semiconductor assembly and test services. Quek directs the efficient execution of packaging and test processes, including wafer grinding, wafer level CSP, and various IC packaging types. Overseeing production floors, the Chief Operating Officer ensures adherence to quality control and manufacturing excellence. Quek's responsibilities extend to optimizing resource allocation and streamlining workflows across Unisem's operational sites. This role involves close collaboration with engineering teams to implement new assembly and test methodologies. By driving operational efficiency, Sh Quek directly supports Unisem's commitment to delivering high-quality OSAT solutions to a global clientele.
Kevin Khoo - Group Chief Operating Officer
Kevin Khoo, the Group Chief Operating Officer at Unisem, spearheads the operational strategy across Unisem's global manufacturing footprint. Khoo directs the integration and optimization of assembly and test services, ensuring consistent quality and output from diverse facilities. The Group Chief Operating Officer's focus includes enhancing supply chain logistics and production scalability for wafer bumping, wafer probing, and substrate IC packaging. Khoo drives initiatives to improve manufacturing yields and reduce turnaround times for complex packaging solutions like wafer level CSP. This leadership role involves close coordination with regional operations to meet evolving customer demands in the semiconductor industry. Through strategic operational oversight, Kevin Khoo reinforces Unisem's capacity to deliver comprehensive OSAT solutions worldwide.
Tan Heng - President & Chief Operating Officer
Tan Heng, the President & Chief Operating Officer at Unisem, leads the company's operational performance and strategic market engagement. Heng directs the execution of Unisem's integrated suite of semiconductor assembly and test services, encompassing wafer grinding, wafer level CSP, and advanced IC packaging. The President & Chief Operating Officer's mandate includes driving operational excellence and ensuring seamless delivery of RF, analog, digital, and mixed signal test solutions. Heng oversees the optimization of manufacturing processes to enhance efficiency and product quality across all operational units. This critical role involves fostering cross-functional collaboration to meet the dynamic needs of the electronics manufacturing sector. By guiding operational strategy, Tan Heng ensures Unisem maintains its leadership in the OSAT market.
C.H. Ang - Group Chief Operating Officer
C.H. Ang, the Group Chief Operating Officer at Unisem, directs the operational efficiency and technological advancement of Unisem's assembly and test services. Ang oversees the implementation of cutting-edge packaging techniques, including substrate IC packaging and wafer level CSP, alongside comprehensive test solutions. The Group Chief Operating Officer's responsibilities involve enhancing production capabilities for wafer bumping and wafer probing, ensuring Unisem meets high-volume manufacturing demands. Ang drives initiatives to improve process yields and maintain stringent quality standards across all global operations. This leadership position requires close collaboration with engineering and R&D teams to integrate new technologies. Through strategic operational management, C.H. Ang strengthens Unisem's service offerings in the competitive OSAT landscape.
Marita Erickson - President
Marita Erickson, the President at Unisem, drives the strategic direction and market positioning of the company's semiconductor assembly and test services. Erickson oversees the expansion of Unisem's integrated offerings, including advanced wafer bumping, wafer probing, and substrate IC packaging. The President's focus includes fostering key client relationships and identifying new market opportunities within the global electronics industry. Erickson directs efforts to enhance Unisem's reputation for reliability and innovation in OSAT solutions. This leadership role involves close collaboration with operational and engineering teams to ensure service excellence. By championing strategic initiatives, Marita Erickson guides Unisem's growth and reinforces its standing as a leading provider of semiconductor packaging and test.
Michael McKerreghan - President & Director
Michael McKerreghan, the President & Director at Unisem, guides the company's strategic growth and corporate governance. McKerreghan oversees the expansion of Unisem's semiconductor assembly and test services, ensuring alignment with long-term business objectives. The President & Director's responsibilities include driving market penetration for advanced packaging solutions like wafer level CSP and substrate IC packaging. McKerreghan focuses on enhancing operational performance and fostering innovation across Unisem's service portfolio, which includes wafer bumping and wafer probing. This leadership role involves close engagement with the board and executive team to shape corporate strategy. By directing key initiatives, Michael McKerreghan strengthens Unisem's market presence and commitment to delivering high-quality OSAT solutions.
Jasmine Liang - Vice President, Sales & Marketing
Jasmine Liang, the Vice President, Sales & Marketing at Unisem, directs the company's go-to-market strategy and revenue generation efforts. Liang oversees the promotion and sales of Unisem's comprehensive suite of semiconductor assembly and test services, including wafer bumping, wafer probing, and substrate IC packaging. The Vice President, Sales & Marketing's focus includes building and maintaining strong customer relationships across the global electronics manufacturing sector. Liang drives initiatives to expand market share for advanced packaging and test solutions, such as wafer level CSP and RF, analog, digital, and mixed signal test. This role involves close collaboration with operational and product development teams to ensure market needs are met. By leading sales and marketing, Jasmine Liang significantly contributes to Unisem's business development and market leadership.
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Frequently Asked Questions Regarding Unisem Top Executives and Leadership Team
