Unisem Executive and Leadership Team

Bruno Guilmart, the Chief Executive Officer at Unisem, directs the overarching strategic vision for the organization. By aligning corporate objectives with the complex demands of the semiconductor assembly and test market, the Chief Executive Officer ensures long-term growth and operational excellence. Guilmart oversees the expansion of service capabilities, including wafer level CSP and advanced packaging technologies, to maintain a competitive edge in the global electronics sector. This leadership role involves constant engagement with the Board to refine market positioning and financial performance. Through rigorous oversight of international business units, the Chief Executive Officer optimizes resource allocation across diverse manufacturing facilities. Bruno Guilmart maintains a focus on scaling production capacity to meet the high-volume requirements of digital and mixed-signal clients. Ultimately, the Chief Executive Officer secures the company's reputation as a premier provider of integrated semiconductor services.

Ho Seng, the Chief Operating Officer at Unisem, manages the internal efficiency of semiconductor assembly and test workflows. By streamlining wafer grinding and probing processes, the Chief Operating Officer drives productivity gains across all manufacturing lines. Seng monitors daily output metrics to ensure strict adherence to quality standards for analog and RF testing services. This role requires close collaboration with engineering teams to implement process improvements that reduce cycle times and minimize waste. Ho Seng coordinates with regional plant managers to synchronize production schedules with client demand, ensuring consistent delivery of high-performance IC packaging. By optimizing the supply chain and equipment utilization, the Chief Operating Officer supports the company's commitment to operational excellence. Through the application of lean manufacturing principles, Seng enhances the overall throughput of the facility, directly contributing to the firm's ability to handle complex, high-density semiconductor projects.

Tan Heng, the President & Chief Operating Officer at Unisem, architects the integration of advanced packaging services with large-scale testing operations. The President & Chief Operating Officer oversees the deployment of new wafer bumping technologies, ensuring technical alignment with the requirements of modern digital signal processing. Heng manages the interface between technical development and commercial execution, facilitating the rapid adoption of new packaging formats. By directing cross-functional teams, the President & Chief Operating Officer ensures that the company maintains a robust portfolio of leadframe and substrate solutions. Tan Heng monitors the performance of regional manufacturing hubs to guarantee consistent quality across all product lines. This leadership position involves balancing immediate production targets with long-term infrastructure investments. Through strategic oversight of technical operations, the President & Chief Operating Officer drives the company's ability to provide comprehensive, end-to-end semiconductor assembly services for a diverse global client base.

C.H. Ang, the Group Chief Operating Officer at Unisem, focuses on the scaling of manufacturing infrastructure to support high-volume semiconductor production. The Group Chief Operating Officer directs the implementation of automated testing systems for mixed-signal and analog devices, ensuring maximum reliability for end-market applications. Ang oversees the standardization of operational protocols across multiple manufacturing sites, fostering a culture of precision and safety. By analyzing production data, the Group Chief Operating Officer identifies opportunities to enhance yield rates and reduce operational costs. C.H. Ang coordinates with procurement and logistics departments to ensure the seamless flow of materials required for complex IC packaging. This role involves managing the technical workforce to maintain high standards of engineering excellence. Through the continuous refinement of assembly processes, the Group Chief Operating Officer strengthens the company's market position as a reliable partner for semiconductor manufacturers requiring sophisticated, high-quality testing and packaging solutions.

Kevin Khoo, the Group Chief Operating Officer at Unisem, manages the strategic expansion of manufacturing capabilities to address emerging trends in the semiconductor industry. The Group Chief Operating Officer directs initiatives related to wafer-level packaging, ensuring that the company remains at the forefront of miniaturization technology. Khoo oversees the integration of new testing equipment, focusing on the specific needs of RF and digital signal applications. By fostering partnerships with key technology providers, the Group Chief Operating Officer ensures that the company utilizes state-of-the-art tools for all assembly services. Kevin Khoo monitors the operational health of the business, implementing robust quality control measures that exceed industry benchmarks. This leadership role involves coordinating with global sales teams to align production capacity with market demand. Through the optimization of facility layouts and workflow management, the Group Chief Operating Officer drives significant improvements in operational agility and service delivery speed.

Marita Erickson, the President at Unisem, leads the commercial strategy and market development efforts for the organization. The President defines the roadmap for service offerings, ensuring that the company's packaging and test capabilities align with the evolving requirements of the global electronics market. Erickson manages high-level client relationships, securing long-term partnerships that drive revenue growth and market share. By analyzing industry shifts, the President identifies new opportunities for service expansion, particularly in the areas of advanced wafer bumping and CSP technologies. Marita Erickson coordinates with the executive team to ensure that commercial goals are supported by robust operational capacity. This leadership role involves representing the company at industry forums and engaging with key stakeholders to promote the firm's technical expertise. Through the development of strategic sales initiatives, the President ensures that the company remains a preferred partner for semiconductor assembly and test services worldwide.