Unisem Executive and Leadership Team

Bruno Guilmart, the Chief Executive Officer at Unisem, directs the company's overall strategic vision and operational execution. Guilmart oversees the integration of wafer bumping, wafer probing, and wafer grinding services, ensuring seamless transitions for clients requiring advanced semiconductor assembly. This leadership role involves guiding the development of diverse packaging solutions, including leadframe, substrate IC packaging, and wafer level CSP, to meet evolving market demands. Guilmart's strategic direction ensures Unisem maintains its position as a leading provider of outsourced semiconductor assembly and test (OSAT) services. The Chief Executive Officer's focus extends to fostering innovation in RF, analog, digital, and mixed-signal test capabilities, driving efficiency and technological advancement across all service offerings. By championing a culture of operational excellence, Bruno Guilmart ensures the company consistently delivers high-quality, reliable solutions to a global clientele, solidifying Unisem's market presence.

Sh Quek, the Chief Operating Officer at Unisem, manages the day-to-day operational activities critical to the company's service delivery. Quek oversees the execution of integrated packaging and test services, ensuring adherence to stringent quality standards across all production lines. This operational leadership encompasses the management of wafer bumping, wafer probing, and wafer grinding processes, optimizing throughput and efficiency. The Chief Operating Officer's responsibilities include ensuring the effective deployment of resources for a wide range of leadframe and substrate IC packaging, as well as wafer level CSP solutions. Quek drives continuous improvement initiatives within the manufacturing facilities, focusing on enhancing yield and reducing cycle times for RF, analog, digital, and mixed-signal test operations. By maintaining robust operational frameworks, Sh Quek supports Unisem's commitment to providing reliable and cost-effective OSAT services to its international customer base, directly contributing to the company's reputation for excellence.

Kevin Khoo, the Group Chief Operating Officer at Unisem, directs operational strategies across the company's global manufacturing footprint. Khoo is responsible for harmonizing operational standards and driving efficiency improvements across multiple facilities, ensuring consistent service delivery for advanced semiconductor assembly and test. This leadership position involves overseeing the implementation of best practices in wafer bumping, wafer probing, and wafer grinding, optimizing resource allocation and production workflows. The Group Chief Operating Officer's purview includes the strategic management of diverse packaging technologies, from leadframe and substrate IC packaging to wafer level CSP, ensuring scalability and adaptability. Kevin Khoo champions initiatives aimed at enhancing the capabilities and capacity for RF, analog, digital, and mixed-signal test services, aligning operations with market demands. By fostering cross-functional collaboration and operational synergy, Khoo ensures Unisem's integrated OSAT solutions meet the rigorous requirements of the global electronics industry, reinforcing the company's competitive edge.

C.H. Ang, the Group Chief Operating Officer at Unisem, spearheads operational excellence and strategic execution across the organization's global semiconductor assembly and test facilities. Ang focuses on optimizing the integrated suite of services, including wafer bumping, wafer probing, and wafer grinding, to enhance production efficiency and client satisfaction. This critical role involves driving the adoption of advanced manufacturing techniques for a broad spectrum of IC packaging, such as leadframe, substrate, and wafer level CSP, ensuring Unisem remains at the forefront of technology. The Group Chief Operating Officer's leadership extends to refining the processes for RF, analog, digital, and mixed-signal test, guaranteeing precision and reliability. C.H. Ang actively collaborates with engineering and production teams to implement innovative solutions that reduce costs and improve turnaround times for outsourced semiconductor assembly and test (OSAT) services. Ang's strategic oversight ensures operational alignment with Unisem's growth objectives and commitment to quality.

Tan Heng, the President & Chief Operating Officer at Unisem, drives the company's operational performance and strategic initiatives across its global semiconductor assembly and test operations. Heng oversees the comprehensive delivery of integrated packaging and test services, including wafer bumping, wafer probing, and wafer grinding, ensuring high standards of quality and efficiency. This leadership role involves managing the development and deployment of a wide array of IC packaging solutions, from leadframe and substrate packaging to wafer level CSP, catering to diverse client needs. The President & Chief Operating Officer's focus is on optimizing the entire operational workflow, from wafer processing to final test for RF, analog, digital, and mixed-signal applications. Tan Heng champions continuous improvement programs and technological advancements within the manufacturing environment, enhancing Unisem's capabilities as a premier outsourced semiconductor assembly and test (OSAT) provider. Heng's strategic guidance ensures operational readiness and scalability to meet the dynamic demands of the global electronics market.

Michael McKerreghan, the President & Director at Unisem, provides strategic leadership and governance for the company's global operations. McKerreghan oversees the long-term strategic planning and corporate direction, ensuring alignment with market opportunities in semiconductor assembly and test services. This executive role involves guiding the expansion of Unisem's integrated offerings, including wafer bumping, wafer probing, wafer grinding, and a comprehensive range of IC packaging solutions. The President & Director's focus extends to fostering innovation in RF, analog, digital, and mixed-signal test capabilities, ensuring Unisem remains a leader in outsourced semiconductor assembly and test (OSAT). Michael McKerreghan collaborates with the executive team to drive operational excellence, financial performance, and sustainable growth. McKerreghan's oversight ensures the company adheres to the highest standards of corporate governance and strategic execution, reinforcing Unisem's commitment to its stakeholders and the global electronics industry.

Marita Erickson, the President at Unisem, leads the strategic direction and operational oversight for key business segments within the company. Erickson is instrumental in driving the growth and development of Unisem's comprehensive semiconductor assembly and test (OSAT) services. This leadership role involves guiding the execution of integrated packaging solutions, including wafer bumping, wafer probing, wafer grinding, and advanced IC packaging technologies like wafer level CSP. The President's focus extends to enhancing the company's capabilities in RF, analog, digital, and mixed-signal testing, ensuring Unisem meets the evolving needs of its global clientele. Marita Erickson works to foster strong client relationships and identify new market opportunities, ensuring Unisem's continued success in providing high-quality manufacturing services. Erickson's strategic vision supports Unisem's commitment to innovation, operational efficiency, and sustained market leadership in the competitive electronics manufacturing landscape.

Jasmine Liang, the Vice President, Sales & Marketing at Unisem, directs the company's commercial strategies and market engagement efforts. Liang is responsible for expanding Unisem's customer base and strengthening relationships within the semiconductor industry, focusing on the integrated suite of packaging and test services. This leadership position involves overseeing the promotion of wafer bumping, wafer probing, and wafer grinding capabilities, alongside a broad range of leadframe and substrate IC packaging and wafer level CSP solutions. The Vice President, Sales & Marketing's efforts are crucial in communicating the value proposition of Unisem's advanced test services for RF, analog, digital, and mixed-signal applications. Jasmine Liang works closely with the operations and engineering teams to ensure market needs are met with tailored solutions, driving revenue growth and market share. Liang's strategic vision for sales and marketing ensures Unisem effectively reaches and serves its global clientele in the competitive OSAT market.