Leadership Overview
Sanmina has 5 executives leading key functions including corporate strategy, information technology, financial management, and printed circuit board manufacturing.
Focused on delivering complex integrated manufacturing solutions, Sanmina drives global innovation through advanced engineering, supply chain logistics, and comprehensive after-market services for diverse industrial sectors.
Focused on delivering complex integrated manufacturing solutions, Sanmina drives global innovation through advanced engineering, supply chain logistics, and comprehensive after-market services for diverse industrial sectors.
Leadership Roles at Sanmina
Jure Sola - Chairman & Chief Executive Officer
Jure Sola, the Chairman & Chief Executive Officer at Sanmina, directs the overarching corporate strategy and long-term vision for the organization. Overseeing global manufacturing operations, the Chairman & Chief Executive Officer ensures alignment between complex production capabilities and evolving market demands. This leadership role involves managing high-level relationships with key stakeholders and driving expansion across international markets. By prioritizing operational excellence and technological advancement, Jure Sola directly impacts the company's ability to provide integrated manufacturing solutions. Sola maintains a focus on sustainable growth, ensuring that the enterprise remains competitive within the global electronics manufacturing landscape. Through rigorous oversight of corporate governance and strategic resource allocation, the Chairman & Chief Executive Officer secures the financial health and market position of the firm, consistently delivering value to shareholders while navigating the complexities of the worldwide electronics supply chain.

Jonathan Faust - Executive Vice President & Chief Financial Officer
Jonathan Faust, the Executive Vice President & Chief Financial Officer at Sanmina, directs the financial planning, capital allocation, and fiscal reporting processes. Overseeing the global treasury and investor relations, the Executive Vice President & Chief Financial Officer ensures the financial stability required to support large-scale manufacturing investments. This role involves managing the balance sheet to facilitate growth in the electronics components and repair services divisions. By optimizing cost structures and monitoring market trends, Jonathan Faust directly influences the profitability and long-term viability of the organization. Faust drives the strategic financial initiatives that enable the company to navigate volatile global markets while maintaining a strong liquidity position. Through rigorous financial oversight and risk management, the Executive Vice President & Chief Financial Officer provides the necessary resources for operational expansion, ensuring that the company remains well-positioned to capitalize on emerging opportunities within the competitive electronics manufacturing industry.

Daniel Dawiedczyk - President, PCB Division
Daniel Dawiedczyk, the President, PCB Division at Sanmina, directs the manufacturing operations and technical development of printed circuit board products. Overseeing the production facilities and engineering teams, the President, PCB Division ensures that all board-level solutions meet stringent quality standards for high-reliability applications. This role involves managing the supply chain for raw materials and coordinating with global clients to deliver custom electronic components. By driving innovation in PCB fabrication techniques, Daniel Dawiedczyk directly impacts the company's ability to serve the aerospace, medical, and industrial sectors. Dawiedczyk manages the division's operational budget and performance metrics, ensuring that production output aligns with market demand. Through the continuous improvement of manufacturing processes, the President, PCB Division maintains the company's leadership in the electronics market, delivering high-performance solutions that form the foundation of modern electronic devices and complex systems worldwide.

Vincent Melvin - Executive Vice President & Chief Information Officer
Vincent Melvin, the Executive Vice President & Chief Information Officer at Sanmina, architects the digital infrastructure and enterprise-wide information systems. Managing the cybersecurity framework and data integrity, the Executive Vice President & Chief Information Officer ensures that all global manufacturing facilities operate with secure, high-performance connectivity. This role involves integrating advanced analytics into the production lifecycle to optimize efficiency and reduce operational downtime. By modernizing internal software platforms, Vincent Melvin directly supports the scalability of the company's logistics and after-market services. Melvin drives the digital transformation agenda, aligning technological investments with the broader manufacturing goals of the organization. Through the implementation of robust IT governance, the Executive Vice President & Chief Information Officer mitigates operational risks and enhances the agility of the entire enterprise, ensuring that data-driven insights inform every critical decision across the global manufacturing footprint.
Manesh Patel - Senior Vice President and Chief Information Officer
Manesh Patel, the Senior Vice President and Chief Information Officer at Sanmina, manages the deployment of specialized manufacturing execution systems and internal communication networks. Overseeing the integration of automated factory floor technologies, the Senior Vice President and Chief Information Officer ensures seamless data flow between production units and corporate management. This leadership role involves optimizing the software architecture that supports complex product assembly and repair services. By streamlining internal workflows, Manesh Patel directly enhances the operational speed and accuracy of the manufacturing process. Patel drives the adoption of cloud-based solutions to improve collaboration across regional teams, ensuring that the company maintains a unified technological standard. Through the continuous refinement of IT systems, the Senior Vice President and Chief Information Officer supports the company's commitment to precision engineering and high-quality output, ultimately strengthening the firm's capability to meet demanding customer requirements in the electronics sector.

Explore Leadership Teams in Electronics
TTM Technologies is a global manufacturer of advanced electronic products and interconnect solutions. It produces printed circuit boards, RF components, microwave assemblies, microelectronics, and engineered systems for aerospace, defense, automotive, medical, networking, communications, and computing applications.
Company Leadership


Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.
Company Leadership KE
HC

StarTech was founded in 1985. This company provides the manufacturing of computer connectors, parts, and accessories. Their headquarters are located in London, Ontario, Canada.
Company Leadership
RS
AM
LD
Mirgor is a leader in transforming technology into experiences across various sectors, including manufacturing, retail, supply chain, and tourism. With over 40 years of experience, the company focuses on delivering high-quality technological products and services while fostering innovation and community engagement. Mirgor's commitment to operational excellence and sustainability is reflected in its strategic alliances and strong production culture. The company aims to meet diverse global needs with tailored solutions, ensuring the well-being and progress of communities worldwide.
Company Leadership JA
PL
RV
ES