Marvell Technology Executive and Leadership Team

We supply state-of-the-art integrated security solutions to small and large organisations around the world to address issues such as security and risk management, personnel workflow and business continuity. Our security division leverages the group's cutting-edge research, development and manufacturing capabilities to bring award-winning access control, intruder alarm and electric non-lethal perimeter security systems to our customers. A strong commitment to innovation is driven by our customers and their changing needs and is delivered around the world to a range of vertical markets including education, correctional facilities, critical infrastructure, mining sites and transport and logistics.

Kaynes Technology India Limited (formally know as Kaynes Technology India Private Limited) Kaynes Technology is a leading end-to-end and IoT solutions-enabled integrated electronics manufacturer in India. The company has capabilities across the entire spectrum of ESDM services.

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.

Socionext, headquartered in Yokohama, Japan, and established in 2015, is a company that designs, develops, and delivers System-on-Chip solutions. They specialize in technology products with applications in consumer, automotive, and industrial markets.