Amkor Technology Executive and Leadership Team

Kevin Engel, the President & Chief Executive Officer at Amkor Technology, directs the overarching strategic vision for global semiconductor packaging and test services. By aligning corporate objectives with the evolving needs of fabless semiconductor companies and integrated device manufacturers, Engel ensures the organization maintains a competitive edge in the complex electronics manufacturing landscape. The President & Chief Executive Officer oversees the expansion of advanced system-in-package modules and wafer-level technologies across diverse international markets. Through rigorous evaluation of market trends in mobile, automotive, and networking sectors, Kevin Engel drives long-term value creation for stakeholders. This leadership role involves constant collaboration with the board to refine operational priorities and capital allocation strategies. By fostering a culture of technical precision and innovation, the President & Chief Executive Officer secures the company's position as a premier partner for original equipment manufacturers worldwide, ultimately guiding the firm toward sustained growth and technological leadership.

Megan Faust, the Executive VP, Chief Financial Officer & Treasurer at Amkor Technology, manages the financial health and capital structure of the organization. By overseeing global financial planning, reporting, and treasury functions, the Executive VP, Chief Financial Officer & Treasurer ensures the availability of resources for capital-intensive investments in advanced packaging technologies like wafer-level fan-out and system-in-package modules. Faust directs the fiscal strategy to support manufacturing expansion across diverse geographic regions, including Japan and the Middle East. This leadership role involves maintaining strong relationships with investors and financial institutions to facilitate long-term growth initiatives. Megan Faust monitors cost structures and operational efficiencies to maximize profitability within the competitive semiconductor services market. By providing rigorous financial oversight, the Executive VP, Chief Financial Officer & Treasurer enables the company to navigate market volatility while continuing to deliver high-performance solutions for mobile, computing, and consumer electronic devices, thereby securing the firm's financial stability and future investment capacity.

Won Lee, the President, Ata Operation at Amkor Technology, executes the operational strategy for the company's advanced packaging and test facilities. By focusing on the technical execution of wafer-level CSP and flip-chip ball grid array production, the President, Ata Operation ensures that manufacturing processes meet the stringent quality standards required by global automotive and networking clients. Lee manages the day-to-day performance of production lines, driving improvements in cycle times and yield for complex silicon wafer integrated fan-out technology. This role involves coordinating with engineering teams to refine package design and test development services, ensuring alignment with the specific needs of original equipment manufacturers. Won Lee oversees the deployment of advanced manufacturing equipment to maintain high-volume output across the Asia Pacific region. By optimizing factory floor operations and resource utilization, the President, Ata Operation directly impacts the company's ability to deliver reliable, high-performance semiconductor solutions that power modern mobile and consumer electronic devices.

HyungSeuk Choi, the Co-President at Amkor Technology, shares responsibility for the strategic direction and operational performance of the company's global business units. By focusing on the integration of advanced system-in-package modules and micro-electro-mechanical systems, the Co-President ensures that the firm remains at the forefront of semiconductor miniaturization. Choi manages key relationships with major contract foundries and integrated device manufacturers, driving collaborative efforts to solve complex packaging challenges for mobile and high-performance computing applications. This leadership role involves overseeing the strategic alignment of manufacturing capabilities with the specific requirements of the wireless charging, radar, and sensor markets. HyungSeuk Choi directs cross-functional teams to accelerate the time-to-market for new packaging technologies, ensuring that the company maintains its status as a preferred partner for global technology leaders. By balancing operational excellence with strategic market expansion, the Co-President secures the firm's ability to deliver cutting-edge solutions that drive the next generation of electronic devices.

Troy Philbert, the Chief Information Officer at Amkor Technology, architects the digital infrastructure necessary to support high-volume semiconductor manufacturing and testing operations. By implementing robust data management systems, the Chief Information Officer ensures seamless integration between wafer-level packaging processes and global supply chain logistics. Philbert manages the cybersecurity framework protecting proprietary intellectual property and sensitive client data across the United States, Asia Pacific, and Europe. This role involves deploying advanced analytics to optimize factory throughput and improve yield rates for complex flip-chip and wirebond products. Troy Philbert drives the digital transformation agenda, enabling real-time visibility into production cycles for integrated device manufacturers and fabless partners. By modernizing enterprise resource planning systems, the Chief Information Officer enhances operational agility and supports the company's ability to scale production for emerging mobile and automotive applications, ensuring that technological capabilities remain aligned with the rigorous demands of the global semiconductor industry.

Donna Fagan, the Chief People Officer, Corporate at Amkor Technology, directs the human capital strategy to support a global workforce engaged in high-precision semiconductor manufacturing. By designing talent acquisition and development programs, the Chief People Officer, Corporate ensures the organization attracts and retains the specialized engineering expertise required for advanced packaging and test services. Fagan oversees organizational design and performance management systems that align employee contributions with the company's mission of delivering innovative silicon solutions. This role involves fostering a culture of safety and technical excellence across international operations, including facilities in the United States, Japan, and Europe. Donna Fagan drives initiatives to enhance employee engagement and leadership development, ensuring the firm remains agile in a rapidly evolving industry. By managing compensation, benefits, and workforce planning, the Chief People Officer, Corporate supports the operational scale necessary to meet the demands of fabless semiconductor companies and original equipment manufacturers, ultimately strengthening the company's competitive position through its people.