Amkor Technology Executive and Leadership Team

Kevin Engel, the President & Chief Executive Officer at Amkor Technology, directs the overarching strategic vision for the organization. Overseeing global operations across the United States, Japan, and the Asia Pacific, the President & Chief Executive Officer ensures alignment between advanced packaging capabilities and the evolving needs of fabless semiconductor companies. This leadership role involves managing complex relationships with original equipment manufacturers while driving long-term growth through technological innovation in wafer-level and system-in-package solutions. By prioritizing operational efficiency and market expansion, Kevin Engel maintains the competitive edge of the firm within the semiconductor manufacturing landscape. The President & Chief Executive Officer consistently evaluates emerging industry trends to refine the corporate roadmap, ensuring that the company remains a primary partner for integrated device manufacturers seeking high-performance, reliable, and scalable semiconductor test and assembly services on a global scale.

Megan Faust, the Executive VP, Chief Financial Officer & Treasurer at Amkor Technology, manages the fiscal health and capital allocation strategies of the organization. Overseeing financial reporting, treasury operations, and investor relations, the Executive VP, Chief Financial Officer & Treasurer ensures the company maintains the liquidity required to fund capital-intensive semiconductor packaging advancements. This role involves analyzing market volatility across the Asia Pacific and global regions to mitigate financial risk while supporting strategic investments in new technologies like silicon wafer integrated fan-out. Megan Faust works closely with the Board to align financial performance with long-term growth objectives, ensuring transparency and regulatory compliance. By optimizing the balance sheet and managing debt structures, the Executive VP, Chief Financial Officer & Treasurer provides the stability necessary for the firm to continue delivering high-end test and assembly services to fabless semiconductor companies and contract foundries worldwide.

HyungSeuk Choi, the Co-President at Amkor Technology, drives the execution of advanced packaging and test initiatives across the company's diverse product portfolio. Overseeing the development of flip chip stacked chip scale packages and micro-electro-mechanical systems, the Co-President ensures that manufacturing processes meet the stringent quality standards required for mobile devices and networking applications. This leadership role involves coordinating with engineering teams to refine wafer-level fan-out packages and specialty silicon solutions. HyungSeuk Choi focuses on scaling production capabilities to support the rapid deployment of new semiconductor technologies in the Asia Pacific and beyond. By fostering collaboration between design and manufacturing units, the Co-President accelerates the time-to-market for complex system-in-package modules. Through rigorous oversight of operational workflows, the Co-President maintains the company's reputation for delivering high-performance, miniaturized mechanical and electromechanical devices that power modern consumer electronics and high-speed computing platforms.

Won Lee, the President, Ata Operation at Amkor Technology, manages the specific operational requirements of the company's advanced test and assembly facilities. Overseeing the production of substrate-based wirebond packages and high-density interconnect solutions, the President, Ata Operation ensures that manufacturing output meets the precise specifications of original equipment manufacturers. This role involves optimizing the throughput of wafer back-grind and final test services to maximize efficiency in the Asia Pacific region. Won Lee coordinates with regional managers to implement lean manufacturing principles, reducing waste and improving yield rates for complex networking and storage applications. By focusing on the technical execution of packaging design and drop shipment services, the President, Ata Operation maintains the reliability of the supply chain for global clients. Through the continuous improvement of assembly processes, the President, Ata Operation supports the company's commitment to delivering high-quality, scalable semiconductor solutions for diverse market segments.

Troy Philbert, the Chief Information Officer at Amkor Technology, architects the digital infrastructure necessary to support high-volume semiconductor packaging and test services. Managing the enterprise-wide technology stack, the Chief Information Officer ensures seamless data integration across global manufacturing sites in Europe, the Middle East, and Africa. This role involves implementing robust cybersecurity protocols to protect proprietary intellectual property while optimizing supply chain visibility for clients. By deploying advanced analytics and automated systems, Troy Philbert enhances the precision of wafer probe and final test processes. The Chief Information Officer collaborates with operational leaders to modernize legacy systems, facilitating faster turnaround times for complex flip chip and leadframe package production. Through the strategic application of information technology, the Chief Information Officer supports the company's mission to provide turnkey solutions that meet the rigorous demands of the mobile consumer electronics and automotive sectors.

Donna Fagan, the Chief People Officer, Corporate at Amkor Technology, directs the human capital strategy to support a global workforce dedicated to semiconductor innovation. Overseeing talent acquisition, organizational development, and employee engagement, the Chief People Officer, Corporate ensures the company attracts and retains the specialized engineering talent required for advanced packaging and test services. This role involves implementing training programs that align with the technical demands of wafer-level CSP and system-in-package production. Donna Fagan fosters a culture of safety and excellence across international operations, ensuring that corporate values remain consistent from the United States to the Asia Pacific. By managing performance management systems and compensation structures, the Chief People Officer, Corporate supports the operational goals of the firm. Through strategic workforce planning, the Chief People Officer, Corporate enables the organization to maintain its leadership position in the competitive semiconductor manufacturing industry.