Winbond Electronics
Electronics · Taiwan · 5K - 10K Employees
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Overview
Headquarters
Keya 1st Rd. Daya Dist. Central Taiwan N...Phone Number
+886 35678168Website
www.winbond.comRevenue
$2.5 BillionStock Symbol
2344Industry
ZI Rank: 1
Signal Type
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ZI Rank
2
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About Winbond Electronics
Winbond Electronics Corporation designs, manufactures, and sells integrated circuits (IC) and related products. The company sells its products in Taiwan, the United States, and Hong Kong.Explore more
Winbond Electronics Org Chart
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Winbond Electronics is experiencing very low activity levels compared to other companies in the Manufacturing sector.
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Winbond Electronics is drawing exceptional interest within the Manufacturing industry, suggesting notable developments or strong market momentum, learn more about Winbond Electronics.
Winbond Electronics Tech Stack
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Winbond Electronics News & Media
Exclusive: Winbond sees AI making memory a strategic resource, maps next growth in DRAM and Flash
AI is turning memory from an inventory risk into a strategic resource. As memory becomes integral to platform and system design, customers are securing supply earlier, making availability increasingly critical to product launches, says Winbond Electronics president James Chen.Winbond accelerates custom memory transition
Winbond Chairman Arthur Chiao said market sentiment in the second half of 2026 would carry the strong momentum seen in the first half, with the overall market remaining in a supply shortage. He expects the current shortage will be difficult to ease in the near term, and said capacity constraints might not be resolved until the second half of 2027.Winbond raises DDR3 prices to match DDR4, accelerates shift to DDR4
Facing ongoing DRAM shortages and widespread capacity constraints, chipmaker Winbond has raised the price of its 4Gb DDR3 chips to match that of equivalent DDR4 products. The company is rapidly increasing DDR4's share to 60-70% of output, with small shipments of 16nm 8Gb DDR4 already underway and sales growth expected in the second quarter of 2026.Winbond prepares 16nm 8Gb DDR4 mass production for 2026 shipment upgrade
Memory maker Winbond Electronics has recently continued to expand capital expenditures by increasing capacity for 16nm and DDR4 DRAM. As inventories of legacy DDR3 products decrease, DDR4 will officially become Winbond's main product in the first half of 2026. The company's new 8Gb DDR4 products manufactured on its in-house 16nm process have recently passed customer qualification smoothly and are expected to enter mass production and shipment in the first to second quarters of 2026.
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Winbond Electronics Corporation designs, manufactures, and sells integrated circuits (IC) and related products. The company sells its products in Taiwan, the United States, and Hong Kong.... Read More
