Tong Hsing Electronic Industries
Electronics · Taiwan · 1K - 5K Employees
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Overview
Headquarters
1125 No.88 Heping Road Ln, Taoyuan, Taiw...Phone Number
+886 226790122Website
www.theil.comRevenue
$454.2 MillionStock Symbol
6271Industry
About Tong Hsing Electronic Industries
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Tong Hsing Electronic Industries News & Media
Taiwan CIS backend firms to embrace strong 2H21
Backend houses including Xintec, ShunSin Technology and Tong Hsing Electronic Industries are expected to post brisker sales results for the second half of 2021 after posting impressive revenue gains in the first half, thanks to growing demand for CMOS image sensors (CIS) for handset and automotive applications, according to industry sources.Foxconn plowing deeper into semiconductor and EV
Foxconn (Hon Hai) Technology Group has recently acquired a 5.03% stake or 120 million shares in Malaysia-based Dagang NeXchange (DNeX) for around NT$720 million (US$25.78 million) from existing DNeX shareholders, which will help further deepen its deployments in the semiconductor and electric vehicle (EV) sectors.CIS backend firm Tong Hsing sees January-February revenues rise nearly 20%
Taiwan-based Tong Hsing Electronic Industries, dedicated to backend services for CMOS image sensors (CIS), saw its revenues rise 19.22% on year to NT$1.272 billion (US$ 42.34 million) in the first two months of 2020 despite the coronavirus outbreak.CIS backend firm Tong Hsing to double capacity by end-2020
Taiwan-based Tong Hsing Electronic Industries, dedicated to backend services for CMOS image sensors (CIS), has disclosed plans to double monthly production capacity to 150,000-160,000 wafers by end-2020, according to company chairman Pierre Chen.
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Frequently Asked Questions Regarding Tong Hsing Electronic Industries
Tong Hsing Electronic Industries, Ltd. is Taiwan supplier and manufacturer in Global Microelectronic Packaging and Ceramic Substrate Fabrication Market. Tong Hsing has been offering the company's customers high quality CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end M... Read More