Tecdia
Electronics · Japan · 11-50 Employees
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Overview
Headquarters
4-3-4 Shibaura, Tokyo, Tokyo, JapanPhone Number
+81 357655400Website
www.tecdia.comRevenue
<$5 MillionIndustry
About Tecdia
Tecdia designs and manufactures machines for both scribing and breaking semiconductor wafers. These include manual operated, semi-automatic, and fully automatic models with various feature options. The company also produce wafer bonders and other products. The company's equipment is designed with an eye to high rigidity and productivity. nitially produced for the Japanese semiconductor industry, the company later expanded into other Asian semiconductor producer markets, and are continuing the company's growth to serve customers worldwide. ur mission is to provide global access to equipment made to meet the innovation and high quality demands of the company's Japanese customers. By serving a more diverse market the company is enriching the company's know-how and will continue to contribute to the technological advance of semiconductor manufacturing.Explore more
SIC Code 35,355NAICS Code 33,333Show moreTecdia Org Chart
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Tecdia designs and manufactures machines for both scribing and breaking semiconductor wafers. These include manual operated, semi-automatic, and fully automatic models with various feature options. The company also produce wafer bonders and other products. The company's equipment is designed with an eye to high rigidity and productivity. nitially p... Read More