SEMICON Taiwan
Cultural & Informational Centers · Taiwan · 51-200 Employees
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Overview
Headquarters
No.1 Jingmao 2nd Rd, Nangang District, T...Phone Number
+886 35601555Website
www.semicontaiwan.orgRevenue
$14.8 MillionIndustry
ZI Rank: 1
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About SEMICON Taiwan
SEMICON Taiwan is a premier exhibition platform for the semiconductor industry, showcasing over 1,200 booths and attracting more than 100,000 professionals. The event highlights critical technology trends such as AI chips, advanced packaging, and quantum computing, while addressing vital industry issues like supply chain resilience and green manufacturing. It serves as a networking hub for global chipmakers, equipment suppliers, and material providers, facilitating collaboration and strategic alliances. SEMICON Taiwan 2025 will take place from September 10-12, 2025, at the Taipei Nangang Exhibition Center.Explore more
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Activity Insights
SEMICON Taiwan is experiencing very low activity levels compared to other companies in the Hospitality sector.
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SEMICON Taiwan is drawing exceptional interest within the Hospitality industry, suggesting notable developments or strong market momentum, learn more about SEMICON Taiwan.
SEMICON Taiwan Tech Stack
A closer look at the technologies used by SEMICON Taiwan
SEMICON Taiwan News & Media
Semiconductor Heavyweights Descend on Taipei for SEMICON Taiwan 2025
Featuring Chip Guru Jim Keller and Industry Pioneer Dr. Chih-Tay Shih HSINCHU, Aug. 29, 2025 /PRNewswire/ -- SEMICON Taiwan 2025 is just two weeks away, and this year's forums will welcome an extraordinary lineup of speakers. Silicon Valley "chip legend" Jim Keller will take the stage at the CEO Summit, while Dr. Chin-Tay Shih, a pioneering force in Taiwan's semiconductor development, is confirmed to join the SEMI 20 Under 40 Awards Ceremony and Tech Master Forum.Advanced Packaging on the Rise: SEMICON Taiwan 2025 Leads the Way
AI and HPC Fuel Advances in Packaging Technology 3DIC, FOPLP, and Chiplet Forums Gain Global Spotlight HSINCHU, Aug. 15, 2025 /PRNewswire/ -- As demand for AI and HPC accelerates, the semiconductor industry is embracing a new era. With Moore's Law slowing and scaling challenges rising, technologies like 3DIC, Fan-Out Panel Level Packaging (FOPLP), chiplets, and co-packaged optics (CPO) are becoming essential for next-level performance and system integration. SEMICON Taiwan 2025 will spotlight thNordson Electronics Solutions to Feature High-Throughput Fluid Dispensing Technologies for Wafer-Level and Panel-Level Packaging at SEMICON Taiwan 2024
CARLSBAD, Calif.--(BUSINESS WIRE)-- #SEMICONTAIWAN--Nordson to feature fluid dispensing technologies for advanced semiconductor packaging at SEMICON Taiwan 2024CyberOptics to Deliver Technical Presentation About the Importance of 3D Inspection for Advanced Packaging at SEMICON Taiwan
MINNEAPOLIS--(BUSINESS WIRE)--CyberOptics to Deliver Technical Presentation About the Importance of 3D Inspection for Advanced Packaging at SEMICON Taiwan
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SEMICON Taiwan is a premier exhibition platform for the semiconductor industry, showcasing over 1,200 booths and attracting more than 100,000 professionals. The event highlights critical technology trends such as AI chips, advanced packaging, and quantum computing, while addressing vital industry issues like supply chain resilience and green manufa... Read More
