Sarcina Technology
Business Services · Taiwan · 1-10 Employees
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Overview
Headquarters
21 Seestrasse, Taipei, Taiwan, TaiwanWebsite
www.sarcinatech.comRevenue
<$5 MillionIndustry
ZI Rank: 1
Signal Type
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ZI Rank
1
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About Sarcina Technology
Sarcina Technology, founded in 2011 and based in Palo Alto, California, is a semiconductor packaging and testing turnkey company that specializes in providing end-to-end custom solutions for high-performance chips. The company offers a comprehensive range of services including package design, testing, and production management, ensuring first-time tape-out success through its exclusive WIPO integrated services. With a focus on advanced packaging technologies and a strong partnership with leading foundries, Sarcina caters to clients in various sectors such as artificial intelligence, data centers, and biomedical applications. Led by industry veterans, Sarcina is committed to delivering cost-effective and reliable semiconductor packaging solutions.Explore more
Sarcina Technology Org Chart
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Activity Insights
Sarcina Technology is experiencing very low activity levels compared to other companies in the Business Services sector.
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Sarcina Technology is drawing exceptional interest within the Business Services industry, suggesting notable developments or strong market momentum, learn more about Sarcina Technology.
Sarcina Technology Tech Stack
A closer look at the technologies used by Sarcina Technology
Sarcina Technology News & Media
Sarcina Unveils Bump Pitch Transformer Capabilities
New Multi-die Technology Radically Alters 2.5D Packaging Landscape PALO ALTO, Calif., June 18, 2024 /PRNewswire/ -- Sarcina Technology, the Application Specific Advanced Packaging (ASAP) Design Service and Production leader, today unveiled its Bump Pitch Transformer design capabilities...Sarcina Technology Demonstrates Packaging Capabilities at Chiplet Summit
Showcases WIPO Services PALO ALTO, Calif., Feb. 6, 2024 /PRNewswire/ -- Sarcina Technology, a leading Application Specific Advanced Packaging (ASAP) Service, will roll out its WIPO service at Chiplet Summit. The company will be in Booth#410. Chiplet Summit runs February 6 through 8 at the...Sarcina Technology Joins Intel Foundry Services (IFS) Accelerator Design Services Alliance
Brings Application Specific Advanced Packaging Services to IFS customers PALO ALTO, Calif., Jan. 25, 2024 /PRNewswire/ -- Sarcina Technology, the leading Application Specific Advanced Packaging service (ASAP), announced today that it has joined Intel Foundry Services (IFS) Accelerator...
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Sarcina Technology, founded in 2011 and based in Palo Alto, California, is a semiconductor packaging and testing turnkey company that specializes in providing end-to-end custom solutions for high-performance chips. The company offers a comprehensive range of services including package design, testing, and production management, ensuring first-time... Read More
