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Nepes
Highly Engaged Employees
Highly Engaged EmployeesElectronics · South Korea · 501-1,000 Employees
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Overview
Headquarters
587-32 Gwahaksanup 2-ro Ochang-eup, Cheo...Phone Number
(858) 429-6703Website
www.nepes.co.krRevenue
$234.6 MillionStock Symbol
033640Industry
About Nepes
Founded in 1990, Nepes is a packaging solution provider in system IC. Started with chemical business, acquired US patent for solder bumping technology for semiconductors in 2004. Nepes commercialized for the first time in Korea, Plating bumping, WLP(Wafer level packaging), FOWLP(Fan-out Wafer level packaging) and PLP(Panel level packaging) technology. Providing FOWLP service to global No.1 Automotive chip maker since 2015 and enhancing PLP service leadership in global OSAT market.Explore more
Nepes Org Chart
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Nepes Tech Stack
A closer look at the technologies used by Nepes
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Frequently Asked Questions Regarding Nepes
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Founded in 1990, Nepes is a packaging solution provider in system IC. Started with chemical business, acquired US patent for solder bumping technology for semiconductors in 2004. Nepes commercialized for the first time in Korea, Plating bumping, WLP(Wafer level packaging), FOWLP(Fan-out Wafer level packaging) and PLP(Panel level packaging) technolo... Read More
