Nepes
Electronics · South Korea · 501-1,000 Employees
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Overview
Headquarters
587-32 Gwahaksanup 2-ro Ochang-eup, Cheo...Phone Number
(858) 429-6703Website
www.nepes.co.krRevenue
$234.6 MillionStock Symbol
033640Industry
ZI Rank: 1
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ZI Rank
4
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About Nepes
Founded in 1990, Nepes is a packaging solution provider in system IC. Started with chemical business, acquired US patent for solder bumping technology for semiconductors in 2004. Nepes commercialized for the first time in Korea, Plating bumping, WLP(Wafer level packaging), FOWLP(Fan-out Wafer level packaging) and PLP(Panel level packaging) technology. Providing FOWLP service to global No.1 Automotive chip maker since 2015 and enhancing PLP service leadership in global OSAT market.Explore more
Nepes Org Chart
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Nepes Tech Stack
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Nepes News & Media
Nepes Laweh setzt mit der Fan-Out-Massenproduktion der M-Serie mit 600 mm großen Platten neue Maßstäbe in der Branche
GOESAN, Südkorea--(BUSINESS WIRE)--Die Nepes Laweh Corporation (Nepes: KOSDAQ 033640) gab die erfolgreiche Produktion des weltweit ersten 600 mm x 600 mm großen Panel Level Packaging (PLP) mit Decas M-Series™ Fan-Out-Technologien bekannt. Nepes Laweh hatte am 7. Dezember in Anwesenheit des Ministers für Handel, Industrie und Energie, des Gouverneurs von Chungcheongbuk-do und Vertretern von Kunden und Partnern eine große Eröffnung der Cheongan Campus PLP Line. Das Unternehmen gab bekannt, dass dNepes Laweh to Set New Industry Benchmark With 600mm Large Panel M-Series Fan-Out Volume Production
GOESAN, South Korea--(BUSINESS WIRE)-- #600mmLargePanelLevelPackaging--Nepes Laweh set an industry benchmark with the newly opened PLP fab facility that can mass produce up to 96,000 of 600mm panels with PLP per year.Nepes Laweh Set New Industry Benchmark with 600mm Large Panel M-Series Fan-Out Volume Production
SAN JOSE, Calif.--(BUSINESS WIRE)--Nepes announced successful production of the world’s first 600mm large Panel Level Packaging (PLP) using Deca’s M-Series™ Fan-out technologies.Nepes Is Now Supplying a Highly Reliable Fan-Out Package to a Leading Wireless Chip Maker
SAN JOSE, Calif.--(BUSINESS WIRE)-- #5G--Nepes (KOSDAQ: 033640), one of the top tier advanced packaging service providers, announces that it has initiated supply of high-reliability Fan-Out package service to a US based leading wireless chip maker. Fan-Out manufacturing is stabilized for mass production of the advanced package line recently acquired from Deca Technologies. "High Reliability Fan-out Package," supplied by nepes, is a high-tech solution with more than 2 times BLR (Board Level Relia
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Founded in 1990, Nepes is a packaging solution provider in system IC. Started with chemical business, acquired US patent for solder bumping technology for semiconductors in 2004. Nepes commercialized for the first time in Korea, Plating bumping, WLP(Wafer level packaging), FOWLP(Fan-out Wafer level packaging) and PLP(Panel level packaging) technolo... Read More
