NEO Semiconductor
Electronics · California, United States · 1-10 Employees
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Overview
Headquarters
1871 The Alameda Ste 250A, San Jose, Cal...Phone Number
+972 546778100Website
www.neosemic.comRevenue
<$5 MillionIndustry
About NEO Semiconductor
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NEO Semiconductor Tech Stack
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NEO Semiconductor News & Media
NEO Semiconductor Launches NEO.AI Memory Platform to Solve AI's Two Biggest Memory Bottlenecks
X-SRAM Delivers Up to 5× Higher On-Chip Memory Density, while 3D X-DRAM Enables Up to 10× Higher HBM Capacity – Breaking the AI Memory Wall by Overcoming SRAM and DRAM Scaling Limits SANTA CLARA, Calif., Aug. 4, 2026 /PRNewswire/ -- NEO Semiconductor, a leading innovator in advanced AI...NEO Semiconductor Introduces World's First Extreme High Bandwidth Memory (X-HBM) Architecture for AI Chips
New X-HBM architecture delivers a 32K-bit wide data bus and potentially 512 Gbit per die density, offering 16X more bandwidth or 10X higher density than traditional HBM SAN JOSE, Calif., Aug. 5, 2025 /PRNewswire/ -- NEO Semiconductor, a leading developer of breakthrough memory...NEO Semiconductor 3D X-AI™ Awarded "Best of Show" for Most Innovative Artificial Intelligence (AI) Application
3D X-AI™ chip technology is targeted to replace the existing HBM chips and solve data bus bottlenecks, received top honors at FMS 2024 SAN JOSE, Calif., Aug. 6, 2024 /PRNewswire/ -- NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM,...NEO Semiconductor Announces the Development of its 3D X-AI Chip; Targeted to Replace Existing HBM Chips and Solve Data Bus Bottlenecks
The new 3D X-AI Chip accelerates AI performance by 100X and reduces power consumption by 99% SAN JOSE, Calif., Aug. 5, 2024 /PRNewswire/ -- NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the development of its 3D...
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Frequently Asked Questions Regarding NEO Semiconductor
Neo Semiconductor is a pioneering company specializing in advanced 3D memory technologies, including 3D NAND flash, 3D DRAM, and AI processing chips. Their innovative products, such as X-HBM and 3D X-DRAM, are designed to meet the growing demands of AI workloads and high-performance computing, offering significant improvements in bandwidth, density... Read More