MEMS USA
Business Services · United Kingdom · 11-50 Employees
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Overview
Headquarters
United KingdomPhone Number
(818) 735-4750Website
www.mems.org.ukRevenue
<$5 MillionIndustry
ZI Rank: 1
Signal Type
Dec
Jan
Feb
Mar
Apr
May
ZI Rank
1
1
1
1
1
1
About MEMS USA
Packaging of MEMS devices presents a technological challenge, Hymite have developed a Magnetic Proximity Switch for in-vivo medical applications. The switch is targeted to replace much bigger conventional reed switches and comes in a 1.8x1.8x0.8mm fully SMT-compatible package. The package is realized by a silicon lid or "cap" ( HyCap ) a chip size hermetic seal. which is provided with electrical through-wafer interconnects (-VIAS). The cap itself is a flip chip device with solder balls and sealing ring on the front side, and SMD pads on the back side. Sealing and soldering of the electrical interconnections is performed within one flip chip assembly process step. Sealing rings and pads on the cap and MEMS sides are perfectly aligned by solder surface tension forces (eutectic AuSn solder is used). MEMS USA, Inc. announced today that it has filed a patent application for its next generation Viscometer. The sensor is installed directly into process pipelines and provides real-time viscosiRead more
Popular SearchesMEMS USA IncMems USASIC Code 87,873NAICS Code 54,541Show more
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Revenue
Number of Employees
Type
Funding
Founded In
MEMS USA
<$5M
11-50
Private
-
2000
N/A
Company Profile Activity
Activity Insights
MEMS USA is experiencing very low activity levels compared to other companies in the Business Services sector.
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MEMS USA is drawing exceptional interest within the Business Services industry, suggesting notable developments or strong market momentum, learn more about MEMS USA.
MEMS USA Tech Stack
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Packaging of MEMS devices presents a technological challenge, Hymite have developed a Magnetic Proximity Switch for in-vivo medical applications. The switch is targeted to replace much bigger conventional reed switches and comes in a 1.8x1.8x0.8mm fully SMT-compatible package. The package is realized by a silicon lid or "cap" ( HyCap ) a chip size... Read More
