JCET Group

JCET Group Co., Ltd., founded in 1972, is a global provider of integrated-circuit manufacturing and technology services. Operating in Electronics and Manufacturing, the company specializes in advanced semiconductor packaging solutions. Its portfolio includes wafer level packaging, system-in-packaging, flip chip, and wire bonding technologies, serving mobile, communication, compute, consumer, automotive, and industrial markets. JCET Group delivers turnkey services from design to shipment, supported by extensive R&D.

With a significant global footprint, JCET Group operates across multiple locations, including its base in Jiangyin, China. The company employs over 10,000 individuals, reflecting substantial operational capacity and workforce expertise. JCET Group offers design and characterization, R&D, wafer probe, water bump, package assembly, shipment, and testing services. This integrated approach ensures end-to-end support for clients' semiconductor needs. Meet JCET Group's team to understand the leadership driving these operations.

The company's technological offerings support next-generation semiconductor packages and advanced features like TSV (Through-Silicon Via). JCET Group's expertise extends to radio frequency identification (RFID) and specialized chip applications, demonstrating broad capability in IC packaging. Its strategic focus on high-performance, cost-effective solutions positions it as a key player in the global semiconductor supply chain, enabling advancements in various electronic devices.