Inari Technology Sdn Bhd
Electronics · 51-200 Employees
View Company Info for Free
Overview
Phone Number
+60 165150872Website
www.inari-tech.comRevenue
$18.1 MillionIndustry
About Inari Technology Sdn Bhd
Inari Technology Sdn Bhdis a leading OSAT provider to multinational and local electronics product manufacturers. Inari Technology is one of a handful of OSAT providers in the ASEAN region performing and providing DC and RF wafer testing, wafer back-grinding, wafer sawing, wire bonding, substrate molding, substrate sawing, chip sip assembly and other related services. Inari Technology has strong technical know-how in these manufacturing processes and quick turnaround response times. Inari Technology is certified with the ISO9001 Quality Management Systems (QMS) and the ISO14001 Environmental Management Systems (QMS) certifications. Inari Technology is strongly committed to high product and service quality and also to environmentally friendly practices by utilizing RoHS compliant process and RoHS compliant materials. Inari also complies with the General Specifications for the Environment (GSE) requirement.Explore more
Inari Technology Sdn Bhd Org Chart
Sell smarter with deeper company insights.
ZoomInfo gives you access to real-time firmographics, buying signals, org charts, and decision-makers - helping your GTM teams prioritize accounts, personalize outreach with AI-driven automation, and close deals faster.
Inari Technology Sdn Bhd Tech Stack
A closer look at the technologies used by Inari Technology Sdn Bhd
See more technologies
Top Electronics Companies
Top companies in Canada by revenue
Top companies in Australia by revenue
Top companies in New Zealand by revenue
Frequently Asked Questions Regarding Inari Technology Sdn Bhd
Sign Up For FreeTo access detailed company insights
Inari Technology Sdn Bhdis a leading OSAT provider to multinational and local electronics product manufacturers. Inari Technology is one of a handful of OSAT providers in the ASEAN region performing and providing DC and RF wafer testing, wafer back-grinding, wafer sawing, wire bonding, substrate molding, substrate sawing, chip sip assembly and othe... Read More
