IEEE International Integrated Reliability Workshop

Since 1982, the Integrated Reliability Workshop and its predecessor, the Wafer Level Reliability Workshop, have provided a unique forum for sharing new approaches to achieve and maintain microelectronic component reliability. The Workshop features presentations, tutorials, open poster sessions, moderated discussion group sessions, and special inter... est group (SIG) meetings. All Workshop activities take place in a relaxed and rustic setting that promotes interactive learning and knowledge sharing. Aggressive cost, reliability, and market entry demands are forcing the semiconductor industry to consider alternatives to the traditional and increasingly inadequate approach of testing-in-reliability (e.g., burn-in, life test). In response to these concerns, the Workshop is continuing to highlight the need for an integrated approach to ensure product reliability, in which a detailed understanding of potential failure mechanisms and their sources are proactively incorporated into robust design and manufacturing practices. The four topical areas for this year's Workshop reflect the scope of this approach and serve as a framework for exploring solutions. The company invite you to submit a presentation proposal that addresses one or more of the following topics: Physics of the Failure Fundamental investigations into potential failure mechanisms, their sources, and methods of activation. _ Role of chemical, electrical, mechanical, or thermal processes leading to failure _ Product or device geometry, materials, and manufacturing sensitivities that contribute to failure _ Failure mechanisms in new and emerging technologies _ Reliability modelsRead More