Chipbond Technology
Electronics · Taiwan · 11-50 Employees
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Overview
Headquarters
5號 no.5 S 6th Rd K.e.p.z., Kaohsiung, Ka...Phone Number
+886 78210088Website
www.chipbond.com.twRevenue
$6.2 MillionIndustry
ZI Rank: 1
Signal Type
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ZI Rank
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About Chipbond Technology
About Chipbond: Founded in 1997 by semiconductor industry veterans, Chipbond Technology was the early pioneer in providing wafer-bumping services to Taiwan, and has been growing at a steady pace to become a technology leader in the industry. Located in Taiwan's Hsin-chu Science-Based Industrial Park. Both gold bumping and solder bumping services are available for customers' advanced packaging technology requirements. In addition to wafer bumping, Chipbond is also providing tape carrier packaging (TPC) and chip on glass (COG) turnkey solutions especially targeted toward a range of display driver ICs.Explore more
Chipbond Technology Org Chart
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Activity Insights
Chipbond Technology is experiencing very low activity levels compared to other companies in the Manufacturing sector.
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Chipbond Technology is drawing exceptional interest within the Manufacturing industry, suggesting notable developments or strong market momentum, learn more about Chipbond Technology.
Chipbond Technology Tech Stack
A closer look at the technologies used by Chipbond Technology
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Chipbond Technology News & Media
Chipbond expects demand recovery in 2Q24
Chipbond Technology, a semiconductor backend house with a strong focus on Display Driver ICs (DDI), expects demand to improve in the second quarter of 2024 although order momentum was weak in the previous quarter, according to company chairman Fei-Jain Wu.E Ink Teams Up with Ecosystem Partners to Develop Next-Generation ePaper Shelf Labels
BILLERICA, Mass.--(BUSINESS WIRE)-- #EInk--E Ink (8069.TW) the originator, pioneer, and global commercial leader in ePaper technology, today announced it is collaborating with ecosystem partners Realtek Semiconductor (Realtek), Integrated Solutions Technology (IST), and Chipbond Technology Corporation (Chipbond) to develop the System on Panel (SoP) architecture. This technology will be integrated into the next-generation electronic shelf label (ESL) jointly developed with the system integrator,Cutting DDI production orders not an easy deal: Q&A with Chipbond Technology chair Fei-Jain Wu
Taiwan-based Chipbond Technology, now holding the world's largest backend capacity for panel display driver ICs (DDI), continues to deepen cooperation with local OSAT Orient Semiconductor Electronics (OSE) and foundry United Microelectronics (UMC) to strengthen its business growth momentum.Chipbond, ChipMOS step up capacity expansion for testing OLED DDI chips
Taiwan-based display driver IC backend specialists Chipbond Technology and ChipMOS Technologies have both stepped up their purchases of high-end testing equipment to satisfy growing demand for OLED DDIs, according to industry sources.
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About Chipbond: Founded in 1997 by semiconductor industry veterans, Chipbond Technology was the early pioneer in providing wafer-bumping services to Taiwan, and has been growing at a steady pace to become a technology leader in the industry. Located in Taiwan's Hsin-chu Science-Based Industrial Park. Both gold bumping and solder bumping services ar... Read More
