AmTECH MICROELECTRONICS

AmTECH is a community of talented and experienced employees who are committed to provide the best manufacturing solution for ADVANCED PACKAGING and SMT ASSEMBLY. The company has a strong reputation for excellent communication skills, superior service, on-time delivery and commitment to quality. "Teamwork is at the core of everything the company do... at AmTECH". AmTECH was founded on 1993 to provide ADVANCED PACKAGING Manufacturing Services, including Chip-On-Board (COB), Chip-On-Flex (COF), IC Assembly, System-in-Package (SiP) and Multichip Modules (MCM) with ultra-fine pitch Gold Ball (KNS-ICONN), Gold Wedge and Aluminum Wedge (H&K BJ815) Wire Bonding Technologies. The company's Micro-Electronics Manufacturing Services includes advanced SMT ASSEMBLY with 01005, 0201, WLCSP, uBGA, DIE, QFN and fine pitch connectors down to 0.3 mm pitch and 0.15 mm ball size, while meeting RoHS compliance for PCB Fabrication, Components and Assembly Processes. The company also offer FLIP CHIP TECHNOLOGY with the company's new state-of-the-art Datacon 2200 EVO PLUS equipment with XY placement accuracy of 7um @ 3s. Die size (0.25 mm - 50 mm) and Flip Chip size (0.5 mm - 50 mm) with Pitch size (0.15 mm - 0.25 mm) and Ball size (0.075 mm - 0.125 mm). Equipment has a Work Area of 12" x 8" (300 mm x 200 mm).Read More