Advanced Packaging
Manufacturing · Maryland, United States · 11-50 Employees
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Overview
Headquarters
4818 Seton Dr, Baltimore, Maryland, 2121...Phone Number
(410) 358-9444Website
www.advpack.comRevenue
$5.2 MillionIndustry
ZI Rank: 1
Signal Type
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ZI Rank
3
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About Advanced Packaging
Based in Baltimore, MD, Advanced Packaging Inc specializes in designing custom foam and case solutions tailored to various industries including aerospace, medical, military, government, communications, and commercial sectors. Founded over 50 years ago, the company has evolved from basic containers to high-end solutions, providing complete design and manufacturing capabilities without acting as a broker. Their offerings include custom foam parts, aluminum cases, and systems integration services, aimed at delivering total packaging solutions. Advanced Packaging Inc prides itself on its customer-driven approach, ensuring collaboration throughout the design and manufacturing process.Explore more
Advanced Packaging Org Chart
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Activity Insights
Advanced Packaging is experiencing very low activity levels compared to other companies in the Manufacturing sector.
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Advanced Packaging is drawing exceptional interest within the Manufacturing industry, suggesting notable developments or strong market momentum, learn more about Advanced Packaging.
Advanced Packaging financials insights
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2020
Debt
$350K
Advanced Packaging Tech Stack
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Most Recent Scoops
Mergers & Acquisitions (M&A)
Mergers & Acquisitions, Acquisitions, Mergers
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Executive Move
Funding
Advanced Packaging has received an SBA PPP loan for $350,000-1 million from PNC Bank, supporting the retention of 25 jobs.
Funding
Advanced Packaging News & Media
Albers Aerospace Expands Capabilities with Acquisitions of Advanced Packaging Inc. and Impact Case & Container
Albers is pleased to announce the acquisitions of Advanced Packaging Inc. and Impact Case & Container, two industry leaders in custom, packaging solutions. MCKINNEY, TX, UNITED STATES, November 14, 2024 /EINPresswire.com/ -- Albers Aerospace is …Substrate-free FOPLP technology gaining ground in advanced packaging market
Chip demand for 5G, AI, and automotive applications continues to grow robustly, but substrates needed to process related chips will remain in short supply until at least 2025, which will accelerate the entry of substrate-free fan-out (FO) backend solutions, such as FOPLP ( panel level package), into the advanced packaging market, according to Robert Lin, general manager of Manz Asia.
Read more news
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Based in Baltimore, MD, Advanced Packaging Inc specializes in designing custom foam and case solutions tailored to various industries including aerospace, medical, military, government, communications, and commercial sectors. Founded over 50 years ago, the company has evolved from basic containers to high-end solutions, providing complete design an... Read More
