Circuits Assembly - Call for Papers -
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Published on: 2/27/2002
Last Visited: 2/27/2002
"Already a major player in imaging and microvia technology, the photon itself is fast becoming the critical, information-carrying unit in telecommunication products and other applications," said Bob Vitas, IPC vice president of Professional Development."IPC, in cooperation with Cookson Electronics, has created this conference to point out the enormous implications Photonics will have on the future of the electronics manufacturing industry."
Papers and presentations are being sought in the following areas:
OE Components: devices and modules Packaging: new concepts and issues for OE, optical-MEMS and MOEMS
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For more information or to submit an abstract, contact Robert Vitas at BobVitas@ipc.org or 847-790-5308.
IPC International Conference on Lead-Free Electronic Assemblies
Deadline for abstracts: February 22, 2002
Doubletree Hotel in San Jose, CAApril 30-May 2, 2002
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This ban in Europe will have a significant impact in the global marketplace; eventually forcing many U.S. manufacturers to eliminate lead as effectively as a U.S. ban would mandate," said Bob Vitas, IPC vice president of Professional Development."This conference provides companies with the information that will be crucial for success in 2006 and 2007."
Papers and presentations are being sought in the following areas:
Policy-European Lead Ban status Component issues
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For more information or to submit an abstract, contact Robert Vitas at BobVitas@ipc.org or 847-790-5308.
IMAPS ISRAEL 2002 - 3rd International Conference on Microelectronics and Packaging
Deadline for abstracts: February 28, 2002
Herzelia - On Sea, IsraelJune 13, 2002