Sean Crowley This is Me

 View all 24 references Web References

1. 1. EE Times - Amkor Ships Billionth MicroLeadFrame(TM) Chip Package

   www.eetimes.com/pressreleases/ - [Cached]

   Published on: 7/10/2003   Last Visited: 7/11/2003

   "In the past few years we have seen rapid adoption of MLF packaging, which offers system designers an unmatched combination of thermal and electrical performance, ease of use and small footprint," commented Sean Crowley, Amkor's vice president for leadframe products. "We've increased weekly capacity from one million units at the beginning of 2002 to 15 million units currently, and we expect to reach 20 million units by the end of this year. MLF has become a critical package for cellular and WLAN applications, and because of the outstanding performance characteristics, we expect that over time many standard analog and linear chips will begin to migrate into MLF packages. The market for QFN packages is expected to increase four-fold to over 3 billion units by 2006. Amkor's MLF had an estimated 60% share of the worldwide QFN market in 2002. "We currently have more than 60 customers designing into MLF across a broad range of formats, including wire bond and flip chip, and we are even seeing designs incorporating stacked die MLF packaging, " said Crowley.

2. 2. www.unitive.com

   www.unitive.com/news/pressrele - [Cached]

   Last Visited: 5/18/2008

   "In the past few years we have seen rapid adoption of MLF packaging, which offers system designers an unmatched combination of thermal and electrical performance, ease of use and small footprint," commented Sean Crowley, Amkor's vice president for leadframe products.
   ...
   "We currently have more than 60 customers designing into MLF across a broad range of formats, including wire bond and flip chip, and we are even seeing designs incorporating stacked die MLF packaging, " said Crowley.

3. 3. Amkor Technology: News: Press Releases: Amkor Expanding MicroLeadFrame Capacity to Meet Market Demand

   www.amkor.com/news/pressreleas - [Cached]

   Published on: 9/23/2002   Last Visited: 5/22/2008

   "Following an impressive start in RF power amplifier applications, our MLF package is rapidly becoming an industry standard for a host of low pin count wireless applications," said Sean Crowley, Amkor's vice president of advanced leadframe products.
   ...
   "Since early 2000, we've increased our MLF capacity ten-fold, and we expect to be capable of producing more than 75 million units per month by the fourth quarter of 2002," said Crowley."We now have more than 50 customers forecasting over 200 different MLF line items, with many more devices presently in design development for MLF solutions."
   
   "MLF represents an outstanding low cost option for a broad range of wireless applications below the 50 pin count range.Amkor's design, engineering and production know-how has positioned us as the leader in the development and commercialization of MLF package technology," said Crowley.
   
   The broad adoption of MLF packaging has positive strategic implications for Amkor.For example, earlier this year, Amkor expanded its business relationship with Philips Semiconductors to include MLF.Under a multi-year agreement, Philips will have access to MLF technology, and Philips and Amkor will embark on a co-production effort to assemble all Philips semiconductor ICs that have been enabled by Amkor's MLF technology, including Philips' recently introduced DQFN package, the world's smallest logic IC package.
   
   "As we continue to create manufacturing efficiencies through high volume production, we can expect to see standard logic and linear products gravitate toward MLF over time," said Crowley.