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This profile was automatically generated using 7 references found on the Internet. This information has not been verified. Learn more...
This profile was automatically generated using 7 references found on the Internet. This information has not been verified. Learn more...
View all 7 references Web References
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1. FCI - Press releases
www.bergelec.com/news/pressrel - [Cached]Published on: 11/1/2001 Last Visited: 11/28/2001
Steve Clark, FCI Product Manager, states, "FCI's BGA technology provides the basis for this high performance dual module DIMM connector. Higher speed and density with improved routing flexibility will be of useful in many applications."
Press Contact: FCI -
2. FCI - Pressroom
www.fciconnect.com/news/pressr - [Cached]Published on: 11/1/2001 Last Visited: 1/15/2005
Steve Clark, FCI Product Manager, states, "FCI's BGA technology provides the basis for this high performance dual module DIMM connector. -
3. FCI - Pressroom
www.bergelectronics.com/news/p - [Cached]Published on: 11/1/2001 Last Visited: 9/22/2003
Steve Clark, FCI Product Manager, states, "FCI's BGA technology provides the basis for this high performance dual module DIMM connector.

