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This profile was automatically generated using 7 references found on the Internet. This information has not been verified. Learn more...

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  1. 1. FCI - Press releases
    www.bergelec.com/news/pressrel - [Cached]

    Published on: 11/1/2001   Last Visited: 11/28/2001

    Steve Clark, FCI Product Manager, states, "FCI's BGA technology provides the basis for this high performance dual module DIMM connector. Higher speed and density with improved routing flexibility will be of useful in many applications."

    Press Contact: FCI
  2. 2. FCI - Pressroom
    www.fciconnect.com/news/pressr - [Cached]

    Published on: 11/1/2001   Last Visited: 1/15/2005

    Steve Clark, FCI Product Manager, states, "FCI's BGA technology provides the basis for this high performance dual module DIMM connector.
  3. 3. FCI - Pressroom
    www.bergelectronics.com/news/p - [Cached]

    Published on: 11/1/2001   Last Visited: 9/22/2003

    Steve Clark, FCI Product Manager, states, "FCI's BGA technology provides the basis for this high performance dual module DIMM connector.

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