Photo of: Kai Chen

Dr. Kai Chen This is Me

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Comlent Technology Inc.
Shanghai, ChinaEmptyState, China

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This profile was automatically generated using 242 references found on the Internet. This information has not been verified. Learn more...

Employment History

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  1. 1. www.compound-semiconductor.com
    www.compound-semiconductor.com - [Cached]

    Published on: 3/19/2008   Last Visited: 6/16/2008

    As part of the strategy, Comlent has built a most competitive technical team and powerful local marketing channels, as well as won strong government support in China," stated by Dr. Kai Chen, President and CEO of Comlent.
  2. 2. GEF Photonics & Chips News -- Optical Components and Subsystems, Communications Chipsets; Passive, Active, ROADM, WSS, DWDM, CWDM, Mux/Demux, Interleaver, EDFA, SOA, Transceiver, Transponder, Transmitter, Receiver, Modulator, Laser, DFB, FP, VCSEL, TOSA,
    www.globalexecutiveforum.net/P - [Cached]

    Published on: 1/24/2007   Last Visited: 1/31/2007

    The cornerstone of this strategy is to focus on enabling however cost effective chip solution for explosive wireless and broadcasting consumer markets in China', stated Dr. Kai Chen, co-founder and CEO of Comlent, 'Following two trends lend Comlent strong support and leverage. On the one hand, China has become the global manufacturing center of consumer electronics. On the other China has drafted and is implementing a series of national standards such as 3G mobile communications (TD-SCDMA vs. CDMA2000 in the US), Digital TV (DMB-T/H and STiMi vs. DVB-H in Europe) and satellite global positioning system (Beidou or CNSS vs. GPS in the US)', continued Dr. Kai Chen, 'To better equip Comlent to benefit most from the opportunities, Comlent has strategically evolved and transformed itself from a BiCMOS based RF only company when started four years ago into a CMOS based RF, mixed signal and digital SoC company.
  3. 3. Comlent Technology Inc.
    www.comlent.com/en/news/conten - [Cached]

    Published on: 1/8/2004   Last Visited: 3/2/2008

    We're careful in positioning our products," Comlent chief executive Kai Chen said. "US and European companies do not care [about xiaolingtong]."

    Mr Chen said the company's chips could reduce the cost of a xiaolingtong handset from US$30 to $25. For cordless phones, which also use radio frequency chips, the cost reduction is about $3 to $22.

    "That 10 per cent is still very significant, very meaningful for Chinese [original equipment manufacturers]," he said.

    Mr Chen estimated mainland manufacturers shipped 60 million cordless phones last year and had 90 per cent of the global market.

    Comlent is confident volume production will begin by the middle of next year. Its foundry partners are Taiwan Semiconductor Manufacturing Co, which produces chips for Comlent using 0.25-micron processing technology, and Jazz Semiconductor of the US, which is making 0.35-micron chips.

    Mr Chen said Comlent was likely to move some production to mainland foundries within two years. "All the [mainland] foundries have approached us," he said.
    ...
    Mr Chen said one advantage his company would enjoy was a proximity to mainland cordless phone and handset manufacturers, allowing Comlent to better serve them.

    Too often overseas companies design chips and then expect their customers to design products to use those chips. "The Chinese manufacturers try to build systems around that chip - good or bad," he said.

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