Mr. Jagdish G. Belani This is Me
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Kulicke & Soffa Industries , Inc.
FORT WASHINGTON, Pennsylvania
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This profile was automatically generated using 10 references found on the Internet. This information has not been verified. Learn more...
This profile was automatically generated using 10 references found on the Internet. This information has not been verified. Learn more...
Employment History
View...View all 10 references Web References
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1. www.sec.gov
www.sec.gov/Archives/edgar/dat - [Cached]Published on: 1/2/2008 Last Visited: 1/3/2008
Jagdish (Jack) Belani (54)
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Includes or consists of shares subject to outstanding options that are currently exercisable or exercisable within 60 days after December 10, 2007 in the following amounts: Mr. Bachman (15,000); Mr. Kulicke (751,332); Mr. O'Steen (69,000); Mr. Pierce (7,500); Mr. Roehm (70,000); Mr. Waite (25,000); Mr. Zadel (69,000); Mr. Belani (268,222); Mr. Carson (188,355); Mr. Rheault (108,975); and Mr. Salmons (301,895). -
2. www.sec.gov
www.sec.gov/Archives/edgar/dat - [Cached]Published on: 10/2/2007 Last Visited: 10/5/2007
0001195266 BELANI JAGDISH G 1005 VIRGINIA DRIVE FT. WASHINGTON PA 19034 0 1 0 0 Senior Vice President -
3. Kulicke and Soffa Industries, Inc. Form 10-K
www.sec.gov/Archives/edgar/dat - [Cached]Published on: 12/13/2005 Last Visited: 12/14/2005
Jagdish (Jack) G. Belani
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Jagdish (Jack) G. Belani holds the position of Senior Vice President of Package Materials and Corporate Marketing. He was appointed to this position in November 2005. Before this, he was Vice President of Wire Bonding and Corporate Marketing, and prior to that, Vice President of all the Business Units and Marketing and prior to that he was President of the Wire Bonding Division and before that President of XLAM which was our high density substrate group. He became an officer of the Company upon joining us in April 1999 as Vice President and President of our high density substrate group. Before joining us, he served for more than three years in the Worldwide Manufacturing Group of Cypress Semiconductor Corporation, a supplier of integrated circuits for network infrastructure and access equipment, where he was Vice President of Assembly and Packaging when he left to join us. Before Cypress, he was with National Semiconductor Corporation for approximately 18 years in a variety of technical and managerial positions and one year with Advanced Micro Devices as a Bipolar Memory Wafer Fabrication Process Development Engineer.

