Mr. Jack G. Belani

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  www.kns.com/KNS07/Templates/showpage.asp?DBID=1&LNGID=1 - [Cached Version]
  Published on: 9/11/2008    Last Visited: 9/11/2008  

  Jack G. Belani
  
  Position: Senior Vice President, Package Materials, Sales and Marketing
  
  Jack G. Belani is Senior Vice President, Package Materials, Sales and Marketing.He is also responsible for Corporate Marketing and Communication.Mr. Belani joined Kulicke & Soffa in April 1999 as Corporate Vice President and President of X-LAM Technologies, which became the K&S Substrate division.

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  www.crpb-isi.com/about/BIOS/BELANI.asp - [Cached Version]
  Published on: 6/25/2003    Last Visited: 6/25/2003  

  Jack Belani Corporate Vice President, Business Units and Marketing
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  Jack BelaniCorporate Vice President, Business Units and MarketingKulicke & Soffa
  
  Jack Belani joined Kulicke & Soffa in April 1999 as Corporate Vice President and President of X-LAM Technologies, which became the K&S Substrate division.In 2001 he served as President of the Wire Bonding Division.Currently, he is Corporate Vice President, Business Units and Marketing, with responsibility for all products and services.He was appointed to this position in February 2002.
  
  Prior to joining Kulicke & Soffa, Mr. Belani was Vice President of Assembly and Packaging in the Worldwide Manufacturing Group of Cypress Semiconductor Corporation for more than three years.Before Cypress, he was with National Semiconductor for approximately 18 years in a variety of technical and managerial positions and one year with Advanced Micro Devices.He held a number of progressively responsible positions at National, rising from senior engineer to director of package technology.
  
  Mr. Belani is a graduate of the Indian Institute of Technology with a degree in chemical engineering.He also has an MS in metallurgical and materials engineering from the Illinois Institute of Technology and a JD degree from the University of Santa Clara.

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  www.kns.com/KNSNew/Templates/showpage.asp?TMID=102&FID= - [Cached Version]
  Published on: 9/29/2003    Last Visited: 8/21/2008  

  Jack Belani, Vice President of Marketing at K&S added, "Coupled with our existing capacity, the new China facility provides the additional production needed to meet growing customer demands.

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  www.kns.com/KNSNew/Templates/showpage.asp?TMID=102&FID= - [Cached Version]
  Published on: 9/17/2001    Last Visited: 8/21/2008  

  Reporting to Jack Belani, president of the company's Wire Bonding Division, Lin will focus on integration of K&S substrates with probe, assembly and test processes to allow development of more advanced semiconductor packages.
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  "As our customers move toward 35-micron pad pitch, they will need leading-edge technologies, ranging from wire bonders, capillaries and bonding wire to fine line width substrates, no-sweep encapsulants and probe and test solutions," Belani said.

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  www.kulickesoffa.com/Templates/showpage.asp?TMID=102&FI - [Cached Version]
  Published on: 12/12/2002    Last Visited: 3/11/2007  

  K&S Vice President of Marketing Jack Belani added, "This significant order is further confirmation of market acceptance for our Maxµm equipment.

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  www.sec.gov/Archives/edgar/data/56978/0000893220-01-501 - [Cached Version]
  Published on: 12/21/2001    Last Visited: 12/26/2001  

  Jack G. Belani holds the position of Vice President and is President of our Wire Bonding Division.He was appointed to these positions in February 2001.He joined us in April 1999 as Vice President and President of our high density substrate group.Prior to joining us, he served for more than three years as Vice President of Assembly & Packaging in the Worldwide Manufacturing Group of Cypress Semiconductor Corporation.Before Cypress he was with National Semiconductor Corporation for approximately 18 years in a variety of technical and managerial positions.

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  www.kulickesoffa.com/Templates/showpage.asp?TMID=102&FI - [Cached Version]
  Published on: 9/4/2002    Last Visited: 3/11/2007  

  K&S Vice President of Marketing Jack Belani added, "We are pleased to announce this new order.

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  www.kulickesoffa.com/KNSNew/Templates/showpage.asp?TMID - [Cached Version]
  Published on: 12/11/2007    Last Visited: 12/11/2007  

  Jack G. Belani
  
  Senior Vice President, Package Materials, Sales and Marketing

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  www.wirelinks.com/wirenews.php?cat=General - [Cached Version]
  Published on: 5/25/2006    Last Visited: 3/21/2007  

  Expanding on the capabilities of its Cupra copper capillary, Kulicke & Soffa Industries Inc. (K&S) has developed the CupraPlus, which it said supports highly consistent and stable fine-wire second bonds while maintaining the quality of the overall wire-bonding process. ~{!0~}The formation of a fine-wire second bond in fine copper wire bonding has been a constant obstacle, mainly due to frequent tail bond failures, inconsistent second bond strength and an unstable bonding process window,~{!1~} said Jack Belani, vice president of the marketing and business units at K&S. ~{!0~}With its unique design and properties, the CupraPlus copper capillary provides for increased second-bond pull strength for a more stable and consistent quality bond throughout a process.~{!1~} To meet different wire bonding challenges, the CupraPlus can handle copper wire from 0.8 mil to 3.0 thicknesses.

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  www.kulickesoffa.com/Templates/showpage.asp?TMID=102&FI - [Cached Version]
  Published on: 5/30/2002    Last Visited: 3/11/2007  

  K&S Vice President of Marketing Jack Belani said, "K&S is working closely with Amkor to meet its current and next-generation interconnect requirements and to help increase Amkor's competitive position in advanced packaging technology."

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