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Wrong Steve Moffatt?

Dr. Steve Moffatt

Chief Technology Officer (Front End Products)

Applied Materials , Inc.

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Applied Materials , Inc.

3050 Bowers Avenue

Santa Clara, California 95054

United States

Company Description

Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing innovative equipment, services and software to enable the manufacture of advanced semiconductor, flat panel display and solar photovoltaic products. Our technologies help make innovat ... more

Find other employees at this company (12,645)

Background Information


Advisory Board Member
Novatrans Group SA



Optical and Quantum Electronics


St. Andrews

bachelor's degree


Web References (10 Total References)

Youth Exploring Science! [cached]

,Steve MoffattCTO, AMGI Region, Applied Materials

"Laser non-equilibrium heating is ... [cached]

"Laser non-equilibrium heating is enabling technology for 3D devices," affirmed Steve Moffatt, chief technology officer, Front End Products, Applied Materials.

NovaTrans :: The Team [cached]

Dr. Steve Moffatt NovaTrans :: The Team NovaTrans :: The Team :: The Team

Dr. Steve Moffatt
Dr. Steve Moffatt was awarded a PhD in Physics from St. Andrews University in Scotland, an MSc in Optical and Quantum Electronics and a bachelor's degree in Physics.
He has had a long career with Applied Materials, from its early days as a small enterprise to the largest $10 billion semiconductor equipment manufacturer and process supplier in the world.
Most recently his career has included CTO, product business management, IP management, M&A and new products and materials in the front-end segment.
Steve has worked "behind the firewall" with the top three semiconductor manufacturers on advanced integrated circuit engineering for 90, 65, 45nm and beyond for the 2006 to 2010 marketplace.
He has also managed, as CEO and COO, several JVs, held board positions for companies in USA and Europe and was responsible for the Applied Materials Ion Implant business for many years. This included leadership of small and large teams in marketing, manufacturing, materials, purchasing, engineering, software, administration and technology.
Steve has wide commercial experience, including development, sales purchasing and M&A in Taiwan, Japan and Europe.
He has more than 15 key active patents and has published over 200 papers in various technology fields.
Steve holds two President of Applied Materials Awards, two British Queen's Awards and also the Dan Maydan Award for Excellence.
Steve received his management training in the Petrochemical industry at Shell Research and has consulted on a wide range of technologies in semiconductors, optics, lasers, software, physics and chemistry.
Steve is a supporter and a patron of dozens of charitable societies across the globe including the Metropolitan Opera Guild, British Museum, Rhododendron and Camellia Group of the Royal Horticultural Society, and the Guggenheim.

Steve Moffatt, CTO, ... [cached]

Steve Moffatt, CTO, Front-end Equipment at Applied Materials (also a speaker at the Next Generation Eco Fab session at the Sustainable Manufacturing Forum at SEMICON West), told SEMI that many established procedures for dealing with arsine and phosphine already exist. He views the efforts by the industry going forward as one of accurately quantifying the size and scope of the problem. "The methods are in place, but the absolute quantities of III-Vs will be substantially higher," said Moffatt.

Additionally, other emissions (e.g., PFCs) that are well regulated and generally understood, will see an increase in the quantities as a result of more layers being processed for 3D chips. Even the potential transition to 450mm wafers will figure into the industry's need for a more accurate scope of the EHS challenges involved. The increase in wafer size will naturally lead to larger manufacturing equipment noted Moffatt and that, in turn, will drive increases in energy, water, and process chemical consumption at both the tool and fab levels.
As regulatory pressure increases on a global scale, the situation also becomes more complex. Beyond the use of new materials such as III-Vs and nanomaterials, Moffatt commented that new methods of energetics (i.e., ways of putting energy into a processing system) will require very careful and close assessment of the risk control measures. Another sustainability issue arises from the basic fact that, as opposed to the highly prevalent element of silicon in the earth's crust, many of the newer materials being used in higher quantities for semiconductor manufacturing (e.g.,Ga, As, etc.) are much less abundant. These exotic materials, of necessity, must be handled in the most efficient of ways.
Going forward, there will be increased regulatory pressure to reduce a fab's carbon footprint and produce more sustainable products. Moffatt says the industry can expect more pressure to reduce greenhouse gas (GHG) emissions along with adhering to conflict minerals regulations and managing EHS concerns throughout the entire life-cycle of a product (Figure 2). "One company can't do it on its own, it's a life-cycle consideration," said Moffatt.
Regarding standards activities on energetics, Moffatt pointed to ongoing collaboration and hazard assessment between SEMI, SEMATECH and other industry groups.
"We will need to continually evaluate the need for additional standards activities - both new and updates - in addition to industry collaboration on "Green" chemistry," said Moffatt. "As a starting point, sustainability concerns could be built into the initial assessment of new chemicals and processes, which will begin the discussion and raise awareness of these issues."
Hill (SEMATECH) and Moffatt (Applied Materials) will be joined by speakers from IMEC, Intel, Samsung, Air Products, and MW Group at the "Next Generation Eco Fab" session of the Sustainable Manufacturing Forum at SEMICON West 2014, July 7-10 in San Francisco, Calif. For more information, visit: - Applied Materials, Soitec explore Ge substrates [cached]

Steve Moffatt, an engineering manager working in the front-end products group at Applied Materials (Santa Clara, Calif.), said that as performance gains begin to slow down in bulk silicon, companies are looking for "any way out of the box, going to extraordinary lengths to develop locally strained structures in silicon, or perhaps moving to thin layers of pure germanium."

"The important thing is to make these engineered substrates available for industrial use at the right costs, and that takes a long time," Moffatt said."Silicon-on-insulator has been in development for many years, and now we see IBM, AMD, Motorola and others using the technology."
Developing industrial-standard technology with germanium will follow a similar course, he said, "but right now it is hard to say if that will take two, five or 10 years."

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